C
Chip Quik Inc.
Standalone parts(384)
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| Part | Type | Color | Capacity | Tip Type | Flux Type | Form | Form | Form | Form | Shelf Life Start | Melting Point [custom] | Melting Point [custom] | Shelf Life | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Composition | Lens Style/Size | Lens Style/Size [diameter] | Lens Style/Size [diameter] | Lamp/Magnifier Type | Mounting Type | Number of Positions | Package Accepted | Material | Board Thickness | Board Thickness | Pitch [x] | Pitch [x] | Proto Board Type | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [y] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Outer Dimension [y] | Outer Dimension [x] | Outer Dimension [y] | Outer Dimension [x] | Thickness | Thickness | Inner Dimension [x] | Inner Dimension [x] | Inner Dimension [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. | Syringe Air Operated | White | 5 cc | Dispenser Needle Tip | ||||||||||||||||||||||||||||||||||||||||||
Chip Quik Inc. | Solder Paste | No-Clean | 35 g | 1.23 oz | 10 cc | Syringe | Date of Manufacture | 361 °F | 183 °C | 12 Months | ||||||||||||||||||||||||||||||||||||
Chip Quik Inc. | Solder Paste | No-Clean | 35 g | 1.23 oz | 10 cc | Syringe | Date of Manufacture | 12 Months | 423 °F | 220 °C | 217 °C | 428 °F | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |||||||||||||||||||||||||||||||||
Chip Quik Inc. | White | 2.5 x 10 Diopter | 45.72 mm | 1.8 in | Lamp Magnifier | Handheld | ||||||||||||||||||||||||||||||||||||||||
Chip Quik Inc. | 28 | SOIC | FR4 Epoxy Glass | 1.6 mm | 0.063 in | 0.05 in | 1.27 mm | SMD to DIP | 0.4 in | 10.16 mm | 10.16 mm | 0.4 in | ||||||||||||||||||||||||||||||||||
Chip Quik Inc. | 48 | QFN | 0.02 in | 0.5 mm | SMD to DIP | 2.4 in | 17.78 mm | 60.96 mm | 0.7 in | |||||||||||||||||||||||||||||||||||||
Chip Quik Inc. | 12 | MSOP | 0.026 in | 0.65 mm | SMD to DIP | 0.6 in | 10.16 mm | 15.24 mm | 0.4 in | |||||||||||||||||||||||||||||||||||||
Chip Quik Inc. | 68 | JLCC LCC PLCC | 0.05 in | 1.27 mm | SMD to PGA | 1.1 " | 27.94 mm | 27.94 mm | 1.1 in | |||||||||||||||||||||||||||||||||||||
Chip Quik Inc. | 163.009 g | 5.75 oz | Aerosol | Date of Manufacture | 24 Months | 77 °F | 68 °F | |||||||||||||||||||||||||||||||||||||||
Chip Quik Inc. | PowerPAK | 8 | Stainless Steel | 0.026 in | 0.65 mm | 22.86 mm | 1.3 in | 0.9 " | 33.02 mm | 0.004 in | 0.102 mm | 3.3 mm | 0.13 " | 0.13 " 3.3 mm |