DIP300-SOIC-28W
ActiveChip Quik Inc.
DIP-28 (0.3" WIDTH, 0.1" PITCH)
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DIP300-SOIC-28W
ActiveChip Quik Inc.
DIP-28 (0.3" WIDTH, 0.1" PITCH)
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | DIP300-SOIC-28W |
|---|---|
| Board Thickness | 1.6 mm |
| Board Thickness | 0.063 in |
| Material | FR4 Epoxy Glass |
| Number of Positions | 28 |
| Package Accepted | SOIC |
| Pitch [x] | 0.05 in |
| Pitch [x] | 1.27 mm |
| Proto Board Type | SMD to DIP |
| Size / Dimension [x] | 0.4 in |
| Size / Dimension [x] | 10.16 mm |
| Size / Dimension [y] | 10.16 mm |
| Size / Dimension [y] | 0.4 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 12.31 | |
| 5 | $ 11.98 | |||
| 10 | $ 11.65 | |||
| 25 | $ 10.98 | |||
| 50 | $ 10.65 | |||
| 100 | $ 9.98 | |||
| 250 | $ 9.32 | |||
| 500 | $ 8.99 | |||
| 1000 | $ 8.65 | |||
Description
General part information
DIP300-SOIC-28W
DIP-28 (0.3" WIDTH, 0.1" PITCH)
Documents
Technical documentation and resources