Beta
⌘K
SOLDER PASTE THERMALLY STABLE WS
| Part | Type | Shelf Life | Shelf Life Start | Form | Form | Melting Point [custom] | Melting Point [custom] | Flux Type | Mesh Type [custom] | Composition |
|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. | Solder Paste | 6 Months | Date of Manufacture | Jar | 17.64 oz 500 g | 138 °C | 281 °F | Water Soluble | 4 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Chip Quik Inc. | Solder Paste | 6 Months | Date of Manufacture | Jar | 17.64 oz 500 g | 217 °C | 423 °F | Water Soluble | 4 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |