SOLDER WIRE 62/36/2 TIN/LEAD/SIL
| Part | Form | Form | Form | Type | Melting Point [custom] | Melting Point [custom] | Composition | Flux Type | Process | Diameter [diameter] | Diameter [diameter] | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. | 1 oz | 28.35 g | Spool | Wire Solder | 354 °F | 179 °C | Sn62Pb36Ag2 (62/36/2) | No-Clean Water Soluble | Leaded | |||
Chip Quik Inc. | 0.5 lb 8 oz | 227 g | Spool | Wire Solder | 280 °F | 138 °C | Bi58Sn42 (58/42) | 1.19 mm | 0.047 in | |||
Chip Quik Inc. | 0.7 oz | 20 g | Spool | Wire Solder | 280 °F | 138 °C | Bi58Sn42 (58/42) | No-Clean Rosin Activated (RA) | 1.02 mm | 0.04 in | ||
Chip Quik Inc. | 3.53 oz | 100 g | Spool | Wire Solder | 280 °F | 138 °C | Bi58Sn42 (58/42) | No-Clean Rosin Activated (RA) | 1.02 mm | 0.04 in | ||
Chip Quik Inc. | 4 oz | 113.4 g | Spool | Wire Solder | 280 °F | 138 °C | Bi58Sn42 (58/42) | 1.19 mm | 0.047 in | |||
Chip Quik Inc. | 2 oz | 56.7 g | Spool | Wire Solder | 280 °F | 138 °C | Bi58Sn42 (58/42) | 1.19 mm | 0.047 in | |||
Chip Quik Inc. | 1 oz | 28.35 g | Spool | Wire Solder | 280 °F | 138 °C | Bi58Sn42 (58/42) | 1.19 mm | 0.047 in | |||
Chip Quik Inc. | 0.35 oz | Spool | Wire Solder | 280 °F | 138 °C | Bi58Sn42 (58/42) | No-Clean Rosin Activated (RA) | 1.02 mm | 0.04 in | 10 g | ||
Chip Quik Inc. | 1.8 oz | 50 g | Spool | Wire Solder | 280 °F | 138 °C | Bi58Sn42 (58/42) | No-Clean Rosin Activated (RA) | 1.02 mm | 0.04 in |