Beta
⌘K
SOLDER PASTE THERMALLY STABLE NC
| Part | Mesh Type [custom] | Type | Shelf Life | Form | Form | Flux Type | Composition | Melting Point [custom] | Melting Point [custom] | Shelf Life Start | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. | 4 | Solder Paste | 12 Months | Jar | 17.64 oz 500 g | No-Clean | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 217 °C | Date of Manufacture | |
Chip Quik Inc. | Solder Paste | 12 Months | Jar | 17.64 oz 500 g | No-Clean | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 217 °C | Date of Manufacture | 3 |