JET551SNL10T5
ActiveChip Quik Inc.
JET PRINTING SOLDER PASTE SN96.5
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet
JET551SNL10T5
ActiveChip Quik Inc.
JET PRINTING SOLDER PASTE SN96.5
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | JET551SNL10T5 |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Flux Type | No-Clean |
| Form | 35 g |
| Form | 1.23 oz |
| Form | 10 cc |
| Form | Syringe |
| Melting Point [Max] [custom] | 220 °C |
| Melting Point [Max] [custom] | 428 °F |
| Melting Point [Min] [custom] | 423 °F |
| Melting Point [Min] [custom] | 217 °C |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 49.95 | |
Description
General part information
JET551SNL10T5
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc
Documents
Technical documentation and resources