Beta

⌘K

I

INPAQ Technology Co., Ltd

Series	Category	# Parts	Status	Description

Part	Spec A	Spec B	Spec C	Spec D	Description

Standalone parts(44)

Part	Package / Case	Type	Q @ Freq	Supplier Device Package	Frequency - Self Resonant	Height - Seated (Max) [Max]	Height - Seated (Max) [Max]	Inductance Frequency - Test	Material - Core	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Shielding	Current Rating (Amps)	Size / Dimension [x]	Size / Dimension [y]	Inductance	DC Resistance (DCR)	Tolerance	Power Line Protection	Capacitance @ Frequency	Voltage - Reverse Standoff (Typ) [Max]	Applications	Bidirectional Channels [custom]	Voltage - Clamping (Max) @ Ipp	Height - Seated (Max) [Max] [z]	DC Resistance (DCR) [Max]	Package / Case	Size / Dimension [x]	Size / Dimension [y]	Number of Lines	Package / Case	Impedance @ Frequency	DC Resistance (DCR) (Max) [Max]	Current Rating (Max) [Max]	Voltage Rating - DC	Height (Max) [Max]	Height (Max) [Max]	Current - Saturation (Isat)	Height - Seated (Max)
INPAQ Technology Co., Ltd WCI1005CP7N5GDG	0402 (1005 Metric)	Wirewound	60 900 MHz	0402	4.8 GHz	0.66 mm	0.026 in	250 MHz	Ceramic	125 °C	-25 °C	Surface Mount	Unshielded	0.68 A	0.047 in 1.19 mm	0.025 in 0.64 mm	7.5 nH	100 mOhm	2 %
INPAQ Technology Co., Ltd TFE10402V06B0DG	0402 (1005 Metric)	Zener		0402						85 °C	-40 °C	Surface Mount									0.05 pF	6 V	HDMI USB	1	20 V
INPAQ Technology Co., Ltd MCI0603TM1N5BHBPDG	0201	Multilayer	14 500 MHz	0201	15 GHz	0.33 mm		500 MHz	Ceramic	125 °C	-55 °C	Surface Mount	Unshielded	600 mA	0.6 mm	0.3 mm	1.5 nH		0.1 nH							0.013 "	150 mOhm	0603 Metric	0.024 "	0.012 "
INPAQ Technology Co., Ltd MCM2012B161GBEDG	0805 (2012 Metric)									85 °C	-40 °C	Surface Mount			2 mm	1.25 mm													0.079 in	0.049 in	2	4 Lead	160 Ohms	400 mOhm	400 mA	10 V	0.043 in	1.1 mm
INPAQ Technology Co., Ltd MCI0603TM9N1HHBPDG	0201	Multilayer	14 500 MHz	0201	3.3 GHz	0.33 mm		500 MHz	Ceramic	125 °C	-55 °C	Surface Mount	Unshielded	0.25 A	0.6 mm	0.3 mm	9.1 nH		3 %							0.013 "	700 mOhm	0603 Metric	0.024 "	0.012 "
INPAQ Technology Co., Ltd MCI0603TG3N0BHBPDG	0201	Multilayer	12 500 MHz	0201	9.5 GHz	0.33 mm		500 MHz	Ceramic	125 °C	-55 °C	Surface Mount	Unshielded	450 mA	0.6 mm	0.3 mm	3 nH		0.1 nH							0.013 "	250 mOhm	0603 Metric	0.024 "	0.012 "
INPAQ Technology Co., Ltd MCI0603TG10NHHBPDG	0201	Multilayer	11 500 MHz	0201	4 GHz	0.33 mm		500 MHz	Ceramic	125 °C	-55 °C	Surface Mount	Unshielded	0.25 A	0.6 mm	0.3 mm	10 nH		3 %							0.013 "	700 mOhm	0603 Metric	0.024 "	0.012 "
INPAQ Technology Co., Ltd WIP201610S-R22MLDG	0806 (2016 Metric)	Wirewound		0806	120 MHz	1 mm	0.039 "	1 MHz	Iron Powder	125 °C	-40 °C	Surface Mount	Shielded	6 A	2 mm	1.6 mm	220 nH	19 mOhm	20 %										0.079 in	0.063 in									7 A
INPAQ Technology Co., Ltd AIP0630GX-6R8MPBDG	Nonstandard	Molded			16.5 MHz		0.118 in	1 MHz	Alloy Powder	125 °C	-40 °C	Surface Mount	Shielded	5.2 A	7.2 mm	6.5 mm	6.8 µH		20 %								44.5 mOhm		0.283 in	0.256 in									9.7 A	3 mm
INPAQ Technology Co., Ltd WIP322512A-2R2MLDG	1210	Drum Core Wirewound		1210		1.2 mm	0.047 in	1 MHz	Iron Powder	125 °C	-40 °C	Surface Mount	Shielded	2.7 A	3.2 mm	2.5 mm	2.2 µH		20 %								72 mOhm	3225 Metric	0.126 in	0.098 in									3.5 A