240-5205-01

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3M (TC)

IC & COMPONENT SOCKET, 40 CONTACTS, QFN TEST SOCKET, 0.5 MM, 240 SERIES, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN Technical Data Sheet EN +1

240-5205-01

Active

3M (TC)

IC & COMPONENT SOCKET, 40 CONTACTS, QFN TEST SOCKET, 0.5 MM, 240 SERIES, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN Technical Data Sheet EN +1

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	240-5205-01

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	25 mOhm
Features	Closed Frame
Housing Material	Polyethersulfone (PES)
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	10
Number of Positions or Pins (Grid) [custom]	40
Number of Positions or Pins (Grid) [custom]	4
Termination	Solder
Termination Post Length	0.118 in
Termination Post Length	3 mm
Type	QFN

240 Series

Part	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Features	Contact Finish - Post	Contact Material - Post	Pitch - Post	Pitch - Post	Housing Material	Type	Type	Type	Contact Resistance	Material Flammability Rating	Contact Material - Mating	Termination	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Current Rating (Amps)	Termination Post Length	Termination Post Length	Operating Temperature [Min]	Operating Temperature [Max]	Number of Pins	Termination Post Length [x]	Termination Post Length [x]	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Number of Positions or Pins (Grid) [custom]	Convert To (Adapter End)	Convert From (Adapter End)
3M (TC) 240-1280-00-0602J	Connector	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	Gold	Closed Frame	Gold	Beryllium Copper	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled	15.24 mm	DIP ZIF (ZIP)	0.6 "	15 mOhm	UL94 V-0	Beryllium Copper	Press-Fit	40	20	2	1 A	0.11 in	2.78 mm	-55 °C	125 °C
3M (TC) 240-1280-19-0602J	Through Hole	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	Gold	Closed Frame	Gold	Beryllium Copper	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled					UL94 V-0	Beryllium Copper	Wire Wrap				1 A			-55 °C	125 °C	40	0.62 in	15.75 mm	0.6 in	DIP	15.24 mm	15.24 mm	DIP	0.6 in
3M (TC) 240-5205-01	Through Hole							Gold	Closed Frame	Gold	Beryllium Copper			Polyethersulfone (PES)		QFN		25 mOhm		Beryllium Copper	Solder		10	4		0.118 in	3 mm												40
3M (TC) 240-1280-29-0602J	Through Hole	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	Gold	Closed Frame	Gold	Beryllium Copper	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled					UL94 V-0	Beryllium Copper	Solder				1 A	0.13 in	3.3 mm	-55 °C	125 °C	40			0.6 in	DIP	15.24 mm	15.24 mm	DIP	0.6 in
3M (TC) 240-3639-19-0602J	Through Hole	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	Gold	Closed Frame	Gold	Beryllium Copper	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled					UL94 V-0	Beryllium Copper	Wire Wrap				1 A			-55 °C	125 °C	40	0.62 in	15.75 mm		DIP	1 "		DIP	25.4 mm		25.4 mm	1 in
3M (TC) 240-1280-09-0602J	Through Hole	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	Gold		Gold	Beryllium Copper	2.54 mm	0.1 in	Polysulfone (PSU) Glass Filled					UL94 V-0	Beryllium Copper	Solder				1 A	0.13 in	3.3 mm	-55 °C	125 °C	40			0.6 in	DIP	15.24 mm	15.24 mm	DIP	0.6 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 147.32
		10	$ 114.97
		25	$ 104.75
		50	$ 97.87
		100	$ 91.64
Newark	Each	1	$ 164.34

Description

General part information

240 Series

40 (4 x 10) Pos QFN Socket Gold Through Hole

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Technical Data Sheet EN

Datasheet