240 Series
Manufacturer: 3M (TC)
Catalog
IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 240 SERIES, 15.24 MM, BERYLLIUM COPPER
| Part | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Features | Contact Finish - Post | Contact Material - Post | Pitch - Post | Pitch - Post | Housing Material | Type | Type | Type | Contact Resistance | Material Flammability Rating | Contact Material - Mating | Termination | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Current Rating (Amps) | Termination Post Length | Termination Post Length | Operating Temperature [Min] | Operating Temperature [Max] | Number of Pins | Termination Post Length [x] | Termination Post Length [x] | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Number of Positions or Pins (Grid) [custom] | Convert To (Adapter End) | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M (TC) | Connector | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Closed Frame | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 15 mOhm | UL94 V-0 | Beryllium Copper | Press-Fit | 40 | 20 | 2 | 1 A | 0.11 in | 2.78 mm | -55 °C | 125 °C | ||||||||||||
3M (TC) | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Closed Frame | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | UL94 V-0 | Beryllium Copper | Wire Wrap | 1 A | -55 °C | 125 °C | 40 | 0.62 in | 15.75 mm | 0.6 in | DIP | 15.24 mm | 15.24 mm | DIP | 0.6 in | ||||||||||||
3M (TC) | Through Hole | Gold | Closed Frame | Gold | Beryllium Copper | Polyethersulfone (PES) | QFN | 25 mOhm | Beryllium Copper | Solder | 10 | 4 | 0.118 in | 3 mm | 40 | ||||||||||||||||||||||||||
3M (TC) | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Closed Frame | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | UL94 V-0 | Beryllium Copper | Solder | 1 A | 0.13 in | 3.3 mm | -55 °C | 125 °C | 40 | 0.6 in | DIP | 15.24 mm | 15.24 mm | DIP | 0.6 in | ||||||||||||
3M (TC) | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Closed Frame | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | UL94 V-0 | Beryllium Copper | Wire Wrap | 1 A | -55 °C | 125 °C | 40 | 0.62 in | 15.75 mm | DIP | 1 " | DIP | 25.4 mm | 25.4 mm | 1 in | ||||||||||||
3M (TC) | Through Hole | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | Gold | Gold | Beryllium Copper | 2.54 mm | 0.1 in | Polysulfone (PSU) Glass Filled | UL94 V-0 | Beryllium Copper | Solder | 1 A | 0.13 in | 3.3 mm | -55 °C | 125 °C | 40 | 0.6 in | DIP | 15.24 mm | 15.24 mm | DIP | 0.6 in |