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SCS240KE2GC11 - TO-247N

SCS240KE2GC11

Active
Rohm Semiconductor

RECTIFIER DIODE, SCHOTTKY, 1 PHASE, 2 ELEMENT, 20A, 1200V V(RRM), SILICON CARBIDE, TO-247, TO-247N, 3 PIN

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet EN4 Steps for Successful Thermal Designing of Power Devices+33
SCS240KE2GC11 - TO-247N

SCS240KE2GC11

Active
Rohm Semiconductor

RECTIFIER DIODE, SCHOTTKY, 1 PHASE, 2 ELEMENT, 20A, 1200V V(RRM), SILICON CARBIDE, TO-247, TO-247N, 3 PIN

Deep-Dive with AI

DocumentsTechnical Data Sheet EN4 Steps for Successful Thermal Designing of Power Devices+33

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS240KE2GC11
Current - Average Rectified (Io) (per Diode)20 A
Current - Reverse Leakage @ Vr400 µA
Diode Configuration1 Pair Common Cathode
Mounting TypeThrough Hole
Operating Temperature - Junction175 °C
Package / CaseTO-247-3
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
Supplier Device PackageTO-247N
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]1.2 kV
Voltage - Forward (Vf) (Max) @ If1.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 24.71
30$ 15.80
120$ 14.66
NewarkEach 1$ 23.97
5$ 23.97
10$ 23.96
25$ 15.81
50$ 15.70
100$ 15.26

Description

General part information

SCS240KE2 Series

Switching loss reduced, enabling high-speed switching . (3-pin package)

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Reliability Test Result

Manufacturing Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Explanation for Marking - TO-247N SiC_Marking-e.pdf

Package Information

SCS240KE2 Data Sheet

Data Sheet

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Anti-Whisker formation

Package Information

About Flammability of Materials

Environmental Data

Taping Information

Package Information

About Export Administration Regulations (EAR)

Export Information

Inner Structure

Package Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Create Symbols for PSpice Models

Models

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

ESD Data

Characteristics Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Package Dimensions

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Diode Types and Applications

Technical Article

Compliance of the ELV directive

Environmental Data

What Is Thermal Design

Thermal Design