248-1282-29-0602J
Active3M (TC)
IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
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248-1282-29-0602J
Active3M (TC)
IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
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Technical Specifications
Parameters and characteristics for this part
| Specification | 248-1282-29-0602J |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Convert From (Adapter End) | 15.24 mm |
| Convert From (Adapter End) | DIP |
| Convert From (Adapter End) | 0.6 in |
| Convert To (Adapter End) | 0.6 in |
| Convert To (Adapter End) | DIP |
| Convert To (Adapter End) | 15.24 mm |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polysulfone (PSU), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 3.3 mm |
| Termination Post Length | 0.13 in |
248 Series
| Part | Contact Material - Mating | Termination | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Housing Material | Termination Post Length | Termination Post Length | Contact Finish - Post | Features | Contact Resistance | Contact Finish - Mating | Mounting Type | Type | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Current Rating (Amps) | Termination Post Length [x] | Termination Post Length [x] | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M (TC) | Beryllium Copper | Solder | 0.02 in | 0.5 mm | 48 | Polyethersulfone (PES) | 0.118 in | 3 mm | Gold | Closed Frame | 25 mOhm | Gold | Through Hole | QFN | Beryllium Copper | ||||||||||||||||||
3M (TC) | Beryllium Copper | Wire Wrap | 0.1 in | 2.54 mm | Polysulfone (PSU) Glass Filled | Gold | Closed Frame | Gold | Through Hole | Beryllium Copper | 30 µin | 0.76 µm | -55 °C | 125 °C | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | 1 A | 0.62 in | 15.75 mm | 2.54 mm | 0.1 in | |||||
3M (TC) | Beryllium Copper | Solder | 0.1 in | 2.54 mm | Polysulfone (PSU) Glass Filled | 0.13 in | 3.3 mm | Gold | Closed Frame | Gold | Through Hole | Beryllium Copper | 30 µin | 0.76 µm | -55 °C | 125 °C | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | 1 A | 2.54 mm | 0.1 in | |||||
3M (TC) | Beryllium Copper | Solder | 0.02 in | 0.5 mm | 48 | Polyethersulfone (PES) | 0.118 in | 3 mm | Gold | Closed Frame | 25 mOhm | Gold | Through Hole | QFN | Beryllium Copper | ||||||||||||||||||
3M (TC) | Beryllium Copper | Solder | 0.1 in | 2.54 mm | Polysulfone (PSU) Glass Filled | 0.13 in | 3.3 mm | Gold | Closed Frame | Gold | Through Hole | Beryllium Copper | 30 µin | 0.76 µm | -55 °C | 125 °C | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | 1 A | 2.54 mm | 0.1 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
248 Series
IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
Documents
Technical documentation and resources