248-5205-01

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3M (TC)

IC & COMPONENT SOCKET, 48 CONTACTS, QFN TEST SOCKET, 0.5 MM, 248 SERIES, BERYLLIUM COPPER

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248-5205-01

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3M (TC)

IC & COMPONENT SOCKET, 48 CONTACTS, QFN TEST SOCKET, 0.5 MM, 248 SERIES, BERYLLIUM COPPER

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	248-5205-01

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	25 mOhm
Features	Closed Frame
Housing Material	Polyethersulfone (PES)
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	48
Pitch - Mating	0.02 in
Pitch - Mating	0.5 mm
Termination	Solder
Termination Post Length	0.118 in
Termination Post Length	3 mm
Type	QFN

248 Series

Part	Contact Material - Mating	Termination	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Housing Material	Termination Post Length	Termination Post Length	Contact Finish - Post	Features	Contact Resistance	Contact Finish - Mating	Mounting Type	Type	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Current Rating (Amps)	Termination Post Length [x]	Termination Post Length [x]	Pitch - Post	Pitch - Post
3M (TC) 248-5205-01	Beryllium Copper	Solder	0.02 in	0.5 mm	48	Polyethersulfone (PES)	0.118 in	3 mm	Gold	Closed Frame	25 mOhm	Gold	Through Hole	QFN	Beryllium Copper
3M (TC) 248-1282-19-0602J	Beryllium Copper	Wire Wrap	0.1 in	2.54 mm		Polysulfone (PSU) Glass Filled			Gold	Closed Frame		Gold	Through Hole		Beryllium Copper	30 µin	0.76 µm	-55 °C	125 °C	0.6 in	DIP	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	1 A	0.62 in	15.75 mm	2.54 mm	0.1 in
3M (TC) 248-1282-29-0602J	Beryllium Copper	Solder	0.1 in	2.54 mm		Polysulfone (PSU) Glass Filled	0.13 in	3.3 mm	Gold	Closed Frame		Gold	Through Hole		Beryllium Copper	30 µin	0.76 µm	-55 °C	125 °C	0.6 in	DIP	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	1 A			2.54 mm	0.1 in
3M (TC) 248-5205-00	Beryllium Copper	Solder	0.02 in	0.5 mm	48	Polyethersulfone (PES)	0.118 in	3 mm	Gold	Closed Frame	25 mOhm	Gold	Through Hole	QFN	Beryllium Copper
3M (TC) 248-1282-09-0602J	Beryllium Copper	Solder	0.1 in	2.54 mm		Polysulfone (PSU) Glass Filled	0.13 in	3.3 mm	Gold	Closed Frame		Gold	Through Hole		Beryllium Copper	30 µin	0.76 µm	-55 °C	125 °C	0.6 in	DIP	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	1 A			2.54 mm	0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 132.13
		10	$ 121.25
		25	$ 116.59
		50	$ 112.70
Newark	Each	1	$ 176.24

Description

General part information

248 Series

48 (4 x 12) Pos QFN Socket Gold Through Hole

Documents

Technical documentation and resources