IC & COMPONENT SOCKET, 48 CONTACTS, QFN TEST SOCKET, 0.5 MM, 248 SERIES, BERYLLIUM COPPER
| Part | Contact Material - Mating | Termination | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Housing Material | Termination Post Length | Termination Post Length | Contact Finish - Post | Features | Contact Resistance | Contact Finish - Mating | Mounting Type | Type | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Operating Temperature [Min] | Operating Temperature [Max] | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Current Rating (Amps) | Termination Post Length [x] | Termination Post Length [x] | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M (TC) | Beryllium Copper | Solder | 0.02 in | 0.5 mm | 48 | Polyethersulfone (PES) | 0.118 in | 3 mm | Gold | Closed Frame | 25 mOhm | Gold | Through Hole | QFN | Beryllium Copper | ||||||||||||||||||
3M (TC) | Beryllium Copper | Wire Wrap | 0.1 in | 2.54 mm | Polysulfone (PSU) Glass Filled | Gold | Closed Frame | Gold | Through Hole | Beryllium Copper | 30 µin | 0.76 µm | -55 °C | 125 °C | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | 1 A | 0.62 in | 15.75 mm | 2.54 mm | 0.1 in | |||||
3M (TC) | Beryllium Copper | Solder | 0.1 in | 2.54 mm | Polysulfone (PSU) Glass Filled | 0.13 in | 3.3 mm | Gold | Closed Frame | Gold | Through Hole | Beryllium Copper | 30 µin | 0.76 µm | -55 °C | 125 °C | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | 1 A | 2.54 mm | 0.1 in | |||||
3M (TC) | Beryllium Copper | Solder | 0.02 in | 0.5 mm | 48 | Polyethersulfone (PES) | 0.118 in | 3 mm | Gold | Closed Frame | 25 mOhm | Gold | Through Hole | QFN | Beryllium Copper | ||||||||||||||||||
3M (TC) | Beryllium Copper | Solder | 0.1 in | 2.54 mm | Polysulfone (PSU) Glass Filled | 0.13 in | 3.3 mm | Gold | Closed Frame | Gold | Through Hole | Beryllium Copper | 30 µin | 0.76 µm | -55 °C | 125 °C | 0.6 in | DIP | 15.24 mm | UL94 V-0 | 30 Áin | 0.76 Ám | 15.24 mm | DIP | 0.6 in | 1 A | 2.54 mm | 0.1 in |