248-1282-19-0602J

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3M (TC)

RECEPTACLE DIP SOCKET 48POS .6"

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248-1282-19-0602J

Active

3M (TC)

RECEPTACLE DIP SOCKET 48POS .6"

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	248-1282-19-0602J

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Convert From (Adapter End)	15.24 mm
Convert From (Adapter End)	DIP
Convert From (Adapter End)	0.6 in
Convert To (Adapter End)	0.6 in
Convert To (Adapter End)	DIP
Convert To (Adapter End)	15.24 mm
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length [x]	0.62 in
Termination Post Length [x]	15.75 mm

248 Series

Part	Contact Material - Mating	Termination	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Housing Material	Termination Post Length	Termination Post Length	Contact Finish - Post	Features	Contact Resistance	Contact Finish - Mating	Mounting Type	Type	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Current Rating (Amps)	Termination Post Length [x]	Termination Post Length [x]	Pitch - Post	Pitch - Post
3M (TC) 248-5205-01	Beryllium Copper	Solder	0.02 in	0.5 mm	48	Polyethersulfone (PES)	0.118 in	3 mm	Gold	Closed Frame	25 mOhm	Gold	Through Hole	QFN	Beryllium Copper
3M (TC) 248-1282-19-0602J	Beryllium Copper	Wire Wrap	0.1 in	2.54 mm		Polysulfone (PSU) Glass Filled			Gold	Closed Frame		Gold	Through Hole		Beryllium Copper	30 µin	0.76 µm	-55 °C	125 °C	0.6 in	DIP	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	1 A	0.62 in	15.75 mm	2.54 mm	0.1 in
3M (TC) 248-1282-29-0602J	Beryllium Copper	Solder	0.1 in	2.54 mm		Polysulfone (PSU) Glass Filled	0.13 in	3.3 mm	Gold	Closed Frame		Gold	Through Hole		Beryllium Copper	30 µin	0.76 µm	-55 °C	125 °C	0.6 in	DIP	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	1 A			2.54 mm	0.1 in
3M (TC) 248-5205-00	Beryllium Copper	Solder	0.02 in	0.5 mm	48	Polyethersulfone (PES)	0.118 in	3 mm	Gold	Closed Frame	25 mOhm	Gold	Through Hole	QFN	Beryllium Copper
3M (TC) 248-1282-09-0602J	Beryllium Copper	Solder	0.1 in	2.54 mm		Polysulfone (PSU) Glass Filled	0.13 in	3.3 mm	Gold	Closed Frame		Gold	Through Hole		Beryllium Copper	30 µin	0.76 µm	-55 °C	125 °C	0.6 in	DIP	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	15.24 mm	DIP	0.6 in	1 A			2.54 mm	0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

248 Series

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole

Documents

Technical documentation and resources