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SCT3105KW7TL - ROHM SCT3080KW7TL

SCT3105KW7TL

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 23 A, 1.2 KV, 0.105 OHM, TO-263 (D2PAK)

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet ENPrecautions during gate-source voltage measurement for SiC MOSFET+46
SCT3105KW7TL - ROHM SCT3080KW7TL

SCT3105KW7TL

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 23 A, 1.2 KV, 0.105 OHM, TO-263 (D2PAK)

Deep-Dive with AI

DocumentsTechnical Data Sheet ENPrecautions during gate-source voltage measurement for SiC MOSFET+46

Technical Specifications

Parameters and characteristics for this part

SpecificationSCT3105KW7TL
Current - Continuous Drain (Id) @ 25°C23 A
Drain to Source Voltage (Vdss)1200 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]51 nC
Input Capacitance (Ciss) (Max) @ Vds574 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / CaseD2PAK (7 Leads + Tab), TO-263-8, TO-263CA
Rds On (Max) @ Id, Vgs137 mOhm
Supplier Device PackageTO-263-7
Vgs(th) (Max) @ Id5.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 11.71
10$ 8.86
Digi-Reel® 1$ 10.57
10$ 9.31
100$ 8.86
Tape & Reel (TR) 1000$ 8.86
NewarkEach 1$ 11.04
10$ 10.50

Description

General part information

SCT3105KRHR Series

AEC-Q101 qualified automotive grade product. SCT3105KRHR is an SiC (Silicon Carbide) trench MOSFET. Features include high voltage resistance, low ON resistance, and fast switching speed.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Precautions during gate-source voltage measurement for SiC MOSFET

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

TO-263-7L Inner Structure

Package Information

Types and Features of Transistors

Application Note

About Export Administration Regulations (EAR)

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Best practices for the connection of Driver Source/Emitter terminals in discrete devices

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

TO-263-7L Explanation for Marking

Package Information

What Is Thermal Design

Thermal Design

TO-263-7L Package Dimensions

Package Information

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Basics and Design Guidelines for Gate Drive Circuits

Schematic Design & Verification

5kW High-Efficiency Fan-less Inverter

Schematic Design & Verification

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

Calculating Power Loss from Measured Waveforms

Schematic Design & Verification

How to Use PLECS Models

Technical Article

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Solving the challenges of driving SiC MOSFETs with new packaging developments

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

About Flammability of Materials

Environmental Data

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Anti-Whisker formation

Package Information

Condition of Soldering

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Moisture Sensitivity Level

Package Information

SCT3105KW7 Data Sheet

Data Sheet

Compliance of the ELV directive

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

SiC MOSFET Layout Design Considerations

Technical Article

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Snubber circuit design methods for SiC MOSFET

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Improvement of switching loss by driver source

Technical Article

Gate-Source Voltage Surge Suppression Methods

Schematic Design & Verification