Zenode.ai Logo
Beta
K
ATS-X53330G-C1-R0 - ATS-X53330G-C1-R0

ATS-X53330G-C1-R0

Active
Advanced Thermal Solutions Inc.

HEAT SINKS BGA COOLING SOLUTIONS WITH SUPERGRIP ATTACHMENT, HIGH PERFORMANCE, 33X33X12.5MM

Deep-Dive with AI

Search across all available documentation for this part.

ATS-X53330G-C1-R0 - ATS-X53330G-C1-R0

ATS-X53330G-C1-R0

Active
Advanced Thermal Solutions Inc.

HEAT SINKS BGA COOLING SOLUTIONS WITH SUPERGRIP ATTACHMENT, HIGH PERFORMANCE, 33X33X12.5MM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationATS-X53330G-C1-R0
Attachment MethodClip, Thermal Material
Fin Height12.5 mm
Fin Height0.492 in
Length32.99 mm
Length1.299 in
MaterialAluminum
Material FinishBlue Anodized
Package CooledBGA
ShapeSquare, Fins
Thermal Resistance @ Forced Air Flow5.8 °C/W
TypeTop Mount
Width [x]32.99 mm
Width [x]1.299 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 20.34
10$ 19.21
25$ 18.08
50$ 16.95
100$ 15.82
300$ 14.69
500$ 14.41
SagerN/A 1$ 21.90
5$ 20.44
10$ 19.78
25$ 18.58
50$ 17.52
100$ 16.35
500$ 15.93
TMEN/A 1$ 27.01
5$ 24.66
10$ 22.16
20$ 20.91
50$ 20.09

Description

General part information

BGA Low Profile Series

Heat Sinks maxiFLOW BGA Heat Sink w/maxiGRIP Attachment, T412, 45x45x14.5mm, 69.6mm Fin Tip