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Microchip Technology
Standalone parts(31808)
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| Part | Output | Package / Case | Frequency Stability | Current - Supply (Max) [Max] | Base Resonator | Function | Type | Mounting Type | Height - Seated (Max) [Max] [z] | Height - Seated (Max) [Max] [z] | Current - Supply (Disable) (Max) [Max] | Operating Temperature [Max] | Operating Temperature [Min] | Frequency | Voltage - Supply [Max] | Voltage - Supply [Min] | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [y] | Speed | Supplier Device Package | USB | Core Processor | Graphics Acceleration | RAM Controllers | Co-Processors/DSP | Security Features | Operating Temperature [custom] | Voltage - I/O | Ethernet | Additional Interfaces | Number of Cores/Bus Width | Reverse Recovery Time (trr) | Technology | Qualification | Supplier Device Package | Capacitance @ Vr, F | Grade | Voltage - DC Reverse (Vr) (Max) [Max] | Operating Temperature - Junction [Max] | Operating Temperature - Junction [Min] | Voltage - Forward (Vf) (Max) @ If | Current - Average Rectified (Io) | Unidirectional Channels [custom] | Power Line Protection | Power - Peak Pulse | Applications | Gain Bandwidth Product | Voltage - Supply Span (Min) [Min] | Slew Rate | Amplifier Type | Number of Circuits | Output Type | Voltage - Supply Span (Max) [Max] | Voltage - Input Offset | Current - Input Bias | Current - Supply | Current - Output / Channel | Voltage - Supply | Interface | Protocol | Duplex | Receiver Hysteresis | EEPROM Size | Oscillator Type | Program Memory Type | RAM Size | Package / Case [y] | Package / Case [y] | Connectivity | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Program Memory Size | Number of I/O | Core Size |
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Microchip Technology | CMOS | 4-VDFN | 25 ppm | 10.5 mA | MEMS | Standby (Power Down) | XO (Standard) | Surface Mount | 0.035 " | 0.9 mm | 15 µA | 85 °C | -40 °C | 33 MHz | 3.3 V | 1.8 V | 3.2 mm | 2.5 mm | 0.126 in | 0.098 in | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology | 427-TFBGA | Surface Mount | 1 GHz | 427-TFBGA (21x18) | USB (3) | ARM® Cortex®-A7 | DDR2 DDR3 DDR3L LPDDR2 LPDDR3 | Multimedia NEON™ MPE | 3DES AES ARM TZ Cryptography SHA-256 SHA-384 SHA-512 SHA1 | -40 °C 105 °C | 1.35 V | 10/100/1000Mbps (1) 10/100Mbps (1) | EBI I2C SPI | 1 Core 32 Bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology | DO-203AA DO-4 Stud | Stud Mount | 200 mA 500 ns | DO-203AA | 150 ns | Reverse Polarity Standard | MIL-PRF-19500/304 | DO-4 | 115 pF | Military | 100 V | 175 ░C | -65 C | 1.5 V | 12 A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology | DO-214AA SMB | Zener | Surface Mount | 150 °C | -65 °C | DO-214AA (SMBJ) | 1 | 600 W | General Purpose | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology | SC-74A SOT-753 | Surface Mount | 125 °C | -40 °C | SOT-23-5 | 10 MHz | 2.2 V | 15 V/µs | Standard | 1 | Rail-to-Rail Single Ended | 5.5 V | 75 µV | 0.4 pA | 720 µA | 57 mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology | Subscriber Line Interface Concept (SLIC) | 1 | 40 mA | 3.3 V | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology | 8-VDFN Exposed Pad | Transceiver | Surface Mount | 125 °C | -40 °C | 18 V | 6 V | 8-DFN (4x4) | LIN | Half | 175 mV | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology | 18-SOIC | Surface Mount | 125 °C | -40 °C | 20 MHz | 18-SOIC | PIC | 128 x 8 | Internal | FLASH | 224 x 8 | 0.295 in | 7.5 mm | UART/USART | 5.5 V | 3 V | 3.5 KB | 16 | 8-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |