RJ45 MODULAR JACK, DIP, SIDE ENT
| Part | Number of Ports | Number of Rows | Number of Positions/Contacts | Connector Type | LED Color | Features | Housing Material | Contact Finish Thickness | Shielding | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Orientation | Contact Finish | Tab Direction | Contact Material | Termination | Height Above Board | Height Above Board | Shield Material | Number of Cores per Jack | Orientation |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Adam Tech | 1 | 1 | 8p8c (RJ45 Ethernet) | Jack | Green Yellow | Board Guide Solder Retention | Polybutylene Terephthalate (PBT) Glass Filled | Flash | Unshielded | Through Hole | 85 °C | -40 °C | 90 ° | Gold | Down | Copper Alloy | Solder | |||||
Adam Tech | 1 | 1 | 8p8c (RJ45 Ethernet) | Jack | Green Yellow | Board Guide Solder Retention | Polybutylene Terephthalate (PBT) Glass Filled | Flash | Shielded | Through Hole | 85 °C | -40 °C | 90 ° | Gold | Up | Phosphor Bronze | Solder | |||||
Adam Tech | 1 | 1 | Jack | Yellow - Green | Board Guide Solder Retention | Polybutylene Terephthalate (PBT) | Flash | Shielded | Through Hole | 70 °C | 0 °C | 90 ° | Gold | Up | Copper Alloy | Solder | 16.87 mm | 0.664 in | Brass Nickel Coated | 8 | ||
Adam Tech | 1 | 1 | Jack | Green - Green Yellow | Board Lock Solder Retention | Thermoplastic | Flash | Shielded EMI Finger | Through Hole | 70 °C | 0 °C | 90 ° | Gold | Up | Phosphor Bronze | Solder | 13.49 mm | 0.531 in | Stainless Steel | 8 | ||
Adam Tech | 1 | 1 | 8p8c (RJ45 Ethernet) | Jack | Green - Green | Board Guide | Polybutylene Terephthalate (PBT) Glass Filled | Flash | Shielded | Through Hole | 85 °C | -40 °C | 90 ° | Gold | Up | Phosphor Bronze | Solder | |||||
Adam Tech | 1 | 1 | 8p8c (RJ45 Ethernet) | Jack | Does Not Contain LED | Board Lock Solder Retention | Polybutylene Terephthalate (PBT) | Flash | Unshielded | Through Hole | 125 °C | -40 °C | 90 ° | Gold | Up | Phosphor Bronze | Solder | |||||
Adam Tech | 1 | 1 | Jack | Green Yellow | Board Guide Solder Retention | Thermoplastic | Flash | Shielded EMI Finger | Through Hole | 70 °C | 0 °C | 90 ° | Gold | Down | Copper Alloy | Solder | 13.49 mm | 0.531 in | Copper Alloy Nickel Coated | |||
Adam Tech | 1 | 1 | 8p8c (RJ45 Ethernet) | Jack | Green Yellow | Board Lock Solder Retention | Glass Filled Nylon 4/6 Polyamide (PA46) | Flash | Unshielded | Through Hole | 85 °C | -40 °C | Gold | Up | Phosphor Bronze | Solder | Vertical | |||||
Adam Tech | 1 | 1 | Jack | Green Yellow | Board Guide Solder Retention | Polybutylene Terephthalate (PBT) Glass Filled | Flash | Shielded EMI Finger | Through Hole | 70 °C | -20 C | 90 ° | Gold | Down | Copper Alloy | Solder | 13.49 mm | 0.531 in | Copper Alloy Nickel Coated | |||
Adam Tech | 1 | 1 | 8p8c (RJ45 Ethernet) | Jack | Green Green - Yellow | Board Guide Solder Retention | Glass Filled Nylon 4/6 Polyamide (PA46) | Flash | Shielded EMI Finger | Through Hole | 85 °C | -40 °C | 90 ° | Gold | Down | Phosphor Bronze | Solder |