DIODE MODULE GP 1.2KV 3TOWER
| Part | Speed | Speed | Mounting Type | Supplier Device Package | Technology | Operating Temperature - Junction [Min] | Operating Temperature - Junction [Max] | Voltage - DC Reverse (Vr) (Max) [Max] | Voltage - Forward (Vf) (Max) @ If | Package / Case | Diode Configuration | Current - Reverse Leakage @ Vr | Current - Average Rectified (Io) (per Diode) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GeneSiC Semiconductor | Standard Recovery >500ns | 200 mA | Chassis Mount | Three Tower | Standard | -40 °C | 175 ░C | 1.2 kV | 1.2 V | Three Tower | 1 Pair Common Cathode | 10 µA | 200 A |
GeneSiC Semiconductor | Standard Recovery >500ns | 200 mA | Chassis Mount | Three Tower | Standard | -55 °C | 150 °C | 1.1 V | Three Tower | 1 Pair Series Connection | 10 µA | 200 A | |
GeneSiC Semiconductor | Standard Recovery >500ns | 200 mA | Chassis Mount | Three Tower | Standard | -40 °C | 175 ░C | 600 V | 1.2 V | Three Tower | 1 Pair Common Cathode | 10 µA | 200 A |
GeneSiC Semiconductor | Standard Recovery >500ns | 200 mA | Chassis Mount | Three Tower | Standard | -55 °C | 150 °C | 1400 V | 1.1 V | Three Tower | 1 Pair Series Connection | 10 µA | 200 A |
GeneSiC Semiconductor | Standard Recovery >500ns | 200 mA | Chassis Mount | Three Tower | Standard | -40 °C | 175 ░C | 1400 V | 1.2 V | Three Tower | 1 Pair Common Cathode | 10 µA | 200 A |
GeneSiC Semiconductor | Standard Recovery >500ns | 200 mA | Chassis Mount | Three Tower | Standard | -55 °C | 150 °C | 1000 V | 1.1 V | Three Tower | 1 Pair Series Connection | 10 çA | 200 A |