628-40ABT4E

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Wakefield-Vette

HEATSINK FOR 45MM BGA

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Wakefield-Vette

HEATSINK FOR 45MM BGA

Technical Specifications

Parameters and characteristics for this part

Specification	628-40ABT4E

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	4 in
Fin Height	101.6 mm
Length	44.45 mm
Length	1.75 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Power Dissipation @ Temperature Rise	2.5 W
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	4 °C/W, 300 LFM
Type	Top Mount
Width [x]	43.18 mm
Width [x]	1.7 in

Part	Type	Material	Power Dissipation @ Temperature Rise	Fin Height	Fin Height	Shape	Length	Length	Attachment Method	Width [x]	Width [x]	Thermal Resistance @ Forced Air Flow	Material Finish	Package Cooled
Wakefield-Vette 628-40AB	Top Mount	Aluminum	2.5 W	0.4 "	10.16 mm	Pin Fins Square	44.45 mm	1.75 in	Thermal Tape Adhesive (Not Included)	43.18 mm	1.7 in	4 °C/W 300 LFM	Black Anodized	ASIC BGA CPU LGA
Wakefield-Vette 628-40ABT4E	Top Mount	Aluminum	2.5 W	4 in	101.6 mm	Pin Fins Square	44.45 mm	1.75 in	Thermal Tape Adhesive (Included)	43.18 mm	1.7 in	4 °C/W 300 LFM	Black Anodized	ASIC BGA CPU LGA

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	700	$ 3.49

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 2.5W @ 30°C Top Mount

Technical documentation and resources