HEATSINK CPU 43MM SQ BLK H=.4"
| Part | Type | Material | Power Dissipation @ Temperature Rise | Fin Height | Fin Height | Shape | Length | Length | Attachment Method | Width [x] | Width [x] | Thermal Resistance @ Forced Air Flow | Material Finish | Package Cooled |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette | Top Mount | Aluminum | 2.5 W | 0.4 " | 10.16 mm | Pin Fins Square | 44.45 mm | 1.75 in | Thermal Tape Adhesive (Not Included) | 43.18 mm | 1.7 in | 4 °C/W 300 LFM | Black Anodized | ASIC BGA CPU LGA |
Wakefield-Vette | Top Mount | Aluminum | 2.5 W | 4 in | 101.6 mm | Pin Fins Square | 44.45 mm | 1.75 in | Thermal Tape Adhesive (Included) | 43.18 mm | 1.7 in | 4 °C/W 300 LFM | Black Anodized | ASIC BGA CPU LGA |