628-40AB

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Wakefield-Vette

HEATSINK CPU 43MM SQ BLK H=.4"

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Active

Wakefield-Vette

HEATSINK CPU 43MM SQ BLK H=.4"

Technical Specifications

Parameters and characteristics for this part

Specification	628-40AB

Attachment Method	Thermal Tape, Adhesive (Not Included)
Fin Height	0.4 "
Fin Height	10.16 mm
Length	44.45 mm
Length	1.75 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Power Dissipation @ Temperature Rise	2.5 W
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	4 °C/W, 300 LFM
Type	Top Mount
Width [x]	43.18 mm
Width [x]	1.7 in

Part	Type	Material	Power Dissipation @ Temperature Rise	Fin Height	Fin Height	Shape	Length	Length	Attachment Method	Width [x]	Width [x]	Thermal Resistance @ Forced Air Flow	Material Finish	Package Cooled
Wakefield-Vette 628-40AB	Top Mount	Aluminum	2.5 W	0.4 "	10.16 mm	Pin Fins Square	44.45 mm	1.75 in	Thermal Tape Adhesive (Not Included)	43.18 mm	1.7 in	4 °C/W 300 LFM	Black Anodized	ASIC BGA CPU LGA
Wakefield-Vette 628-40ABT4E	Top Mount	Aluminum	2.5 W	4 in	101.6 mm	Pin Fins Square	44.45 mm	1.75 in	Thermal Tape Adhesive (Included)	43.18 mm	1.7 in	4 °C/W 300 LFM	Black Anodized	ASIC BGA CPU LGA

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 2.5W @ 30°C Top Mount

Technical documentation and resources