224-5205-01

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3M (TC)

IC & COMPONENT SOCKET, 24 CONTACTS, QFN TEST SOCKET, 0.5 MM, 224 SERIES, BERYLLIUM COPPER

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224-5205-01

Active

3M (TC)

IC & COMPONENT SOCKET, 24 CONTACTS, QFN TEST SOCKET, 0.5 MM, 224 SERIES, BERYLLIUM COPPER

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DocumentsDatasheet Technical Data Sheet EN +1

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	224-5205-01

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	25 mOhm
Housing Material	Polyethersulfone (PES)
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	24
Pitch - Mating	0.02 in
Pitch - Mating	0.5 mm
Termination	Solder
Termination Post Length	0.118 in
Termination Post Length	3 mm
Type	QFN

224 Series

Part	Contact Material - Post	Mounting Type	Termination Post Length	Termination Post Length	Type	Number of Positions or Pins (Grid)	Termination	Contact Material - Mating	Contact Finish - Mating	Contact Finish - Post	Housing Material	Contact Resistance	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Features	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Termination Post Length [x]	Termination Post Length [x]	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Number of Pins	Convert From (Adapter End)
3M (TC) 224-5205-01	Beryllium Copper	Through Hole	0.118 in	3 mm	QFN	24	Solder	Beryllium Copper	Gold	Gold	Polyethersulfone (PES)	25 mOhm	0.02 in	0.5 mm
3M (TC) 224-5248-00-0602J	Beryllium Copper	Connector	0.11 in	2.78 mm	DIP ZIF (ZIP)	24	Press-Fit	Beryllium Copper	Gold	Gold	Polysulfone (PSU) Glass Filled	15 mOhm	0.1 in	2.54 mm	30 µin	0.76 µm	7.62 mm	0.3 in	1 A	30 Áin	0.76 Ám	UL94 V-0	2.54 mm	0.1 in	-55 °C	125 °C	Closed Frame
3M (TC) 224-1275-19-0602J	Beryllium Copper	Through Hole					Wire Wrap	Beryllium Copper	Gold	Gold	Polysulfone (PSU) Glass Filled		0.1 in	2.54 mm	30 µin	0.76 µm			1 A	30 Áin	0.76 Ám	UL94 V-0	2.54 mm	0.1 in	-55 °C	125 °C	Closed Frame	0.6 in	DIP	15.24 mm	0.62 in	15.75 mm	15.24 mm	DIP	0.6 in	24
3M (TC) 224-5248-19-0602J	Beryllium Copper	Through Hole					Solder	Beryllium Copper	Gold	Gold	Polysulfone (PSU) Glass Filled		0.1 in	2.54 mm	30 µin	0.76 µm			1 A	30 Áin	0.76 Ám	UL94 V-0	2.54 mm	0.1 in	-55 °C	125 °C		0.3 in	DIP	7.62 mm				DIP	7.62 mm	24	0.3 in
3M (TC) 224-1275-29-0602J	Beryllium Copper	Through Hole	0.13 in	3.3 mm			Solder	Beryllium Copper	Gold	Gold	Polysulfone (PSU) Glass Filled		0.1 in	2.54 mm	30 µin	0.76 µm			1 A	30 Áin	0.76 Ám	UL94 V-0	2.54 mm	0.1 in	-55 °C	125 °C	Closed Frame	0.6 in	DIP	15.24 mm			15.24 mm	DIP	0.6 in	24

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 108.19
		20	$ 99.28
		40	$ 92.28
		100	$ 87.19
Newark	Each	1	$ 144.30

Description

General part information

224 Series

24 (4x4) Pos QFN Socket Gold Through Hole

Documents

Technical documentation and resources

Datasheet

Technical Data Sheet EN

Datasheet

Technical Data Sheet EN

Datasheet