IC & COMPONENT SOCKET, 24 CONTACTS, QFN TEST SOCKET, 0.5 MM, 224 SERIES, BERYLLIUM COPPER
| Part | Contact Material - Post | Mounting Type | Termination Post Length | Termination Post Length | Type | Number of Positions or Pins (Grid) | Termination | Contact Material - Mating | Contact Finish - Mating | Contact Finish - Post | Housing Material | Contact Resistance | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Pitch - Post | Pitch - Post | Operating Temperature [Min] | Operating Temperature [Max] | Features | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Termination Post Length [x] | Termination Post Length [x] | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Number of Pins | Convert From (Adapter End) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M (TC) | Beryllium Copper | Through Hole | 0.118 in | 3 mm | QFN | 24 | Solder | Beryllium Copper | Gold | Gold | Polyethersulfone (PES) | 25 mOhm | 0.02 in | 0.5 mm | |||||||||||||||||||||||
3M (TC) | Beryllium Copper | Connector | 0.11 in | 2.78 mm | DIP ZIF (ZIP) | 24 | Press-Fit | Beryllium Copper | Gold | Gold | Polysulfone (PSU) Glass Filled | 15 mOhm | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 7.62 mm | 0.3 in | 1 A | 30 Áin | 0.76 Ám | UL94 V-0 | 2.54 mm | 0.1 in | -55 °C | 125 °C | Closed Frame | ||||||||||
3M (TC) | Beryllium Copper | Through Hole | Wire Wrap | Beryllium Copper | Gold | Gold | Polysulfone (PSU) Glass Filled | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 1 A | 30 Áin | 0.76 Ám | UL94 V-0 | 2.54 mm | 0.1 in | -55 °C | 125 °C | Closed Frame | 0.6 in | DIP | 15.24 mm | 0.62 in | 15.75 mm | 15.24 mm | DIP | 0.6 in | 24 | ||||||||
3M (TC) | Beryllium Copper | Through Hole | Solder | Beryllium Copper | Gold | Gold | Polysulfone (PSU) Glass Filled | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 1 A | 30 Áin | 0.76 Ám | UL94 V-0 | 2.54 mm | 0.1 in | -55 °C | 125 °C | 0.3 in | DIP | 7.62 mm | DIP | 7.62 mm | 24 | 0.3 in | |||||||||||
3M (TC) | Beryllium Copper | Through Hole | 0.13 in | 3.3 mm | Solder | Beryllium Copper | Gold | Gold | Polysulfone (PSU) Glass Filled | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 1 A | 30 Áin | 0.76 Ám | UL94 V-0 | 2.54 mm | 0.1 in | -55 °C | 125 °C | Closed Frame | 0.6 in | DIP | 15.24 mm | 15.24 mm | DIP | 0.6 in | 24 |