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SCS210KE2HRC11 - INFINEON IDYH80G200C5XKSA1

SCS210KE2HRC11

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, DUAL COMMON CATHODE, 1.2 KV, 10 A, 17 NC, TO-247

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SCS210KE2HRC11 - INFINEON IDYH80G200C5XKSA1

SCS210KE2HRC11

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, DUAL COMMON CATHODE, 1.2 KV, 10 A, 17 NC, TO-247

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS210KE2HRC11
Current - Average Rectified (Io) (per Diode)5 A
Current - Reverse Leakage @ Vr100 µA
Diode Configuration1 Pair Common Cathode
Mounting TypeThrough Hole
Operating Temperature - Junction175 °C
Package / CaseTO-247-3
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
Supplier Device PackageTO-247
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]1.2 kV
Voltage - Forward (Vf) (Max) @ If1.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 7.83
30$ 5.26
NewarkEach 1$ 10.96
10$ 10.13
25$ 6.87
60$ 6.36
120$ 5.86
270$ 5.86
510$ 5.84

Description

General part information

SCS210KE2HR Series

Switching loss reduced, enabling high-speed switching . (3-pin package)

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

PCB Layout Thermal Design Guide

Thermal Design

ESD Data

Characteristics Data

Compliance of the ELV directive

Environmental Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Inner Structure

Package Information

Explanation for Marking - TO-247N SiC_Marking-e.pdf

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

4 Steps for Successful Thermal Designing of Power Devices

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Create Symbols for PSpice Models

Models

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Taping Information

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

SCS210KE2HR Data Sheet

Data Sheet

About Export Administration Regulations (EAR)

Export Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Diode Types and Applications

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Package Dimensions

Package Information

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Anti-Whisker formation

Package Information