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71V67603S133BQI - 165-TBGA

71V67603S133BQI

Obsolete
Renesas Electronics Corporation

3.3V 256K X 36 SYNCHRONOUS 3.3V I/O PIPELINED SRAM

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71V67603S133BQI - 165-TBGA

71V67603S133BQI

Obsolete
Renesas Electronics Corporation

3.3V 256K X 36 SYNCHRONOUS 3.3V I/O PIPELINED SRAM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification71V67603S133BQI
Access Time4.2 ns
Clock Frequency133 MHz
Memory FormatSRAM
Memory InterfaceParallel
Memory Organization [custom]36
Memory Organization [custom]256 K
Memory Size9 Mbit
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case165-TBGA
Supplier Device Package165-CABGA (13x15)
TechnologySRAM - Synchronous, SDR
Voltage - Supply [Max]3.465 V
Voltage - Supply [Min]3.135 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

71V67603 Series

The 71V67603 3.3V CMOS SRAM is organized as 256K x 36. The 71V67603 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.The order of these three addresses are defined by the internal burst counter and the LBO input pin.