220-2600-00-0602

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3M (TC)

IC & COMPONENT SOCKET, 20 CONTACTS, SIP SOCKET, 2.54 MM, 220 SERIES, 3.66 MM, BERYLLIUM COPPER

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220-2600-00-0602

Active

3M (TC)

IC & COMPONENT SOCKET, 20 CONTACTS, SIP SOCKET, 2.54 MM, 220 SERIES, 3.66 MM, BERYLLIUM COPPER

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DocumentsDatasheet Technical Data Sheet EN

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	220-2600-00-0602

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Housing Material	Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	20
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.3 mm
Termination Post Length	0.13 in
Type	ZIF (ZIP), SIP

220 Series

Part	Number of Positions or Pins (Grid) [custom]	Current Rating (Amps)	Type	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Mounting Type	Contact Finish - Post	Pitch - Post	Pitch - Post	Termination	Termination Post Length	Termination Post Length	Housing Material	Contact Material - Post	Material Flammability Rating	Contact Finish - Mating	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Termination Post Length [x]	Termination Post Length [x]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Number of Positions or Pins (Grid)
3M (TC) 220-2600-00-0602	20	1 A	SIP ZIF (ZIP)	0.1 in	2.54 mm	30 µin	0.76 µm	-55 °C	125 °C	Beryllium Copper	Through Hole	Gold	2.54 mm	0.1 in	Solder	3.3 mm	0.13 in	Polysulfone (PSU) Glass Filled	Beryllium Copper	UL94 V-0	Gold
3M (TC) 220-2600-50-0602	20	1 A	SIP ZIF (ZIP)	0.1 in	2.54 mm	30 µin	0.76 µm	-55 °C	125 °C	Beryllium Copper	Through Hole	Gold	2.54 mm	0.1 in	Solder	3.3 mm	0.13 in	Polysulfone (PSU) Glass Filled	Beryllium Copper	UL94 V-0	Gold
3M (TC) 220-3342-19-0602J		1 A		0.1 in	2.54 mm	30 µin	0.76 µm	-55 °C	125 °C	Beryllium Copper	Through Hole	Gold	2.54 mm	0.1 in	Wire Wrap			Polysulfone (PSU) Glass Filled	Beryllium Copper	UL94 V-0	Gold	0.3 in	DIP	7.62 mm	DIP	0.3 in	7.62 mm	0.62 in	15.75 mm	30 Áin	0.76 Ám	Closed Frame
3M (TC) 220-7201-55-1902		1 A	SOIC			30 µin	0.76 µm	-55 °C	150 °C	Beryllium Copper	Through Hole	Gold			Solder	3.56 mm	0.14 in	Polyethersulfone (PES) Glass Filled	Beryllium Copper	UL94 V-0	Gold											Closed Frame	20

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 51.82
		10	$ 47.56
		30	$ 45.73
		50	$ 44.20
		100	$ 41.76

Description

General part information

220 Series

20 (1 x 20) Pos SIP, ZIF (ZIP) Socket Gold Through Hole

Documents

Technical documentation and resources

Datasheet

Technical Data Sheet EN

Datasheet