220-7201-55-1902

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3M (TC)

IC & COMPONENT SOCKET, 20 CONTACTS, SOIC SOCKET, 2.54 MM, 220 SERIES, 7.62 MM, BERYLLIUM COPPER

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220-7201-55-1902

Active

3M (TC)

IC & COMPONENT SOCKET, 20 CONTACTS, SOIC SOCKET, 2.54 MM, 220 SERIES, 7.62 MM, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN Datasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	220-7201-55-1902

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyethersulfone (PES), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	20
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Termination	Solder
Termination Post Length	3.56 mm
Termination Post Length	0.14 in
Type	SOIC

220 Series

Part	Number of Positions or Pins (Grid) [custom]	Current Rating (Amps)	Type	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Mounting Type	Contact Finish - Post	Pitch - Post	Pitch - Post	Termination	Termination Post Length	Termination Post Length	Housing Material	Contact Material - Post	Material Flammability Rating	Contact Finish - Mating	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Termination Post Length [x]	Termination Post Length [x]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Number of Positions or Pins (Grid)
3M (TC) 220-2600-00-0602	20	1 A	SIP ZIF (ZIP)	0.1 in	2.54 mm	30 µin	0.76 µm	-55 °C	125 °C	Beryllium Copper	Through Hole	Gold	2.54 mm	0.1 in	Solder	3.3 mm	0.13 in	Polysulfone (PSU) Glass Filled	Beryllium Copper	UL94 V-0	Gold
3M (TC) 220-2600-50-0602	20	1 A	SIP ZIF (ZIP)	0.1 in	2.54 mm	30 µin	0.76 µm	-55 °C	125 °C	Beryllium Copper	Through Hole	Gold	2.54 mm	0.1 in	Solder	3.3 mm	0.13 in	Polysulfone (PSU) Glass Filled	Beryllium Copper	UL94 V-0	Gold
3M (TC) 220-3342-19-0602J		1 A		0.1 in	2.54 mm	30 µin	0.76 µm	-55 °C	125 °C	Beryllium Copper	Through Hole	Gold	2.54 mm	0.1 in	Wire Wrap			Polysulfone (PSU) Glass Filled	Beryllium Copper	UL94 V-0	Gold	0.3 in	DIP	7.62 mm	DIP	0.3 in	7.62 mm	0.62 in	15.75 mm	30 Áin	0.76 Ám	Closed Frame
3M (TC) 220-7201-55-1902		1 A	SOIC			30 µin	0.76 µm	-55 °C	150 °C	Beryllium Copper	Through Hole	Gold			Solder	3.56 mm	0.14 in	Polyethersulfone (PES) Glass Filled	Beryllium Copper	UL94 V-0	Gold											Closed Frame	20

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 46.28
		10	$ 40.53
		30	$ 38.78
		50	$ 37.53
		100	$ 36.28
		250	$ 34.27

Description

General part information

220 Series

20 (2 x 10) Pos SOIC Socket Gold Through Hole

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet