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SCS208AJTLL - Product dimension image

SCS208AJTLL

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Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, BARRIER, 650V SERIES, SINGLE, 650 V, 8 A, 13 NC, TO-263AB

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Search across all available documentation for this part.

DocumentsImpedance Characteristics of Bypass CapacitorSCS208AJ Data Sheet+36
SCS208AJTLL - Product dimension image

SCS208AJTLL

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, BARRIER, 650V SERIES, SINGLE, 650 V, 8 A, 13 NC, TO-263AB

Deep-Dive with AI

DocumentsImpedance Characteristics of Bypass CapacitorSCS208AJ Data Sheet+36

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS208AJTLL
Capacitance @ Vr, F291 pF
Current - Average Rectified (Io)8 A
Current - Reverse Leakage @ Vr160 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]175 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263AB, TO-263-3
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.50
10$ 3.77
Digi-Reel® 1$ 4.50
10$ 3.77
Tape & Reel (TR) 1000$ 2.32
2000$ 2.19
NewarkEach 1$ 2.41

Description

General part information

SCS208AJHR Series

Switching loss reduced, enabling high-speed switching. (Surface mount package)

Documents

Technical documentation and resources

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

SCS208AJ Data Sheet

Data Sheet

Compliance of the ELV directive

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Flammability of Materials

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

Reliability Test Result

Manufacturing Data

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Inner Structure

Package Information

Diode Types and Applications

Technical Article

Moisture Sensitivity Level

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Package Dimensions

Package Information

Taping Information

Package Information

ESD Data

Characteristics Data

Explanation for Marking

Package Information

Anti-Whisker formation

Package Information

About Export Administration Regulations (EAR)

Export Information

Condition of Soldering

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Technical Data Sheet EN

Datasheet

TO-263AB (LPTL) Taping Spec

Datasheet

SiC Flammability

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