W25M02GVTBJT

Obsolete

Winbond Electronics

IC FLASH 2GBIT SPI/QUAD 24TFBGA

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W25M02GVTBJT

Obsolete

Winbond Electronics

IC FLASH 2GBIT SPI/QUAD 24TFBGA

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	W25M02GVTBJT

Access Time	7 ns
Clock Frequency	104 MHz
Memory Format	FLASH
Memory Interface	SPI - Quad I/O
Memory Organization	256M x 8
Memory Size	2 Gbit
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Package / Case	24-TBGA
Supplier Device Package	24-TFBGA (8x6)
Technology	FLASH - NAND (SLC)
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	2.7 V
Write Cycle Time - Word, Page	700 µs

W25M02 Series

Part	Write Cycle Time - Word, Page	Memory Size	Memory Format	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case [x]	Package / Case	Package / Case [y]	Memory Interface	Memory Organization	Supplier Device Package	Technology	Voltage - Supply [Min]	Voltage - Supply [Max]	Clock Frequency	Access Time	Mounting Type	Memory Type
Winbond Electronics W25M02GVSFJR	700 µs	2 Gbit	FLASH	105 °C	-40 °C	0.295 in	16-SOIC	7.5 mm	SPI - Quad I/O	256M x 8	16-SOIC	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVZEJR	700 µs	2 Gbit	FLASH	105 °C	-40 °C		8-WDFN Exposed Pad		SPI - Quad I/O	256M x 8	8-WSON (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVSFJT	700 µs	2 Gbit	FLASH	105 °C	-40 °C	0.295 in	16-SOIC	7.5 mm	SPI - Quad I/O	256M x 8	16-SOIC	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTCIT TR	700 µs	2 Gbit	FLASH	85 °C	-40 °C		24-TBGA		SPI	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz		Surface Mount	Non-Volatile
Winbond Electronics W25M02GVZEIR	700 µs	2 Gbit	FLASH	85 °C	-40 °C		8-WDFN Exposed Pad		SPI - Quad I/O	256M x 8	8-WSON (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVSFIR	700 µs	2 Gbit	FLASH	85 °C	-40 °C	0.295 in	16-SOIC	7.5 mm	SPI - Quad I/O	256M x 8	16-SOIC	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTBIG TR	700 µs	2 Gbit	FLASH	85 °C	-40 °C		24-TBGA		SPI	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz		Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTBJT	700 µs	2 Gbit	FLASH	105 °C	-40 °C		24-TBGA		SPI - Quad I/O	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTCJT	700 µs	2 Gbit	FLASH	105 °C	-40 °C		24-TBGA		SPI - Quad I/O	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTBIR	700 µs	2 Gbit	FLASH	85 °C	-40 °C		24-TBGA		SPI - Quad I/O	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

W25M02 Series

FLASH - NAND (SLC) Memory IC 2Gbit SPI - Quad I/O 104 MHz 7 ns 24-TFBGA (8x6)

Documents

Technical documentation and resources