W25M02GVTBIG TR

Obsolete

Winbond Electronics

IC FLASH 2GBIT SPI 24TFBGA

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DocumentsDeclaration on California Proposition 65 Datasheet

W25M02GVTBIG TR

Obsolete

Winbond Electronics

IC FLASH 2GBIT SPI 24TFBGA

Deep-Dive with AI

DocumentsDeclaration on California Proposition 65 Datasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	W25M02GVTBIG TR

Clock Frequency	104 MHz
Memory Format	FLASH
Memory Interface	SPI
Memory Organization	256M x 8
Memory Size	2 Gbit
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	24-TBGA
Supplier Device Package	24-TFBGA (8x6)
Technology	FLASH - NAND (SLC)
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	2.7 V
Write Cycle Time - Word, Page	700 µs

W25M02 Series

Part	Write Cycle Time - Word, Page	Memory Size	Memory Format	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case [x]	Package / Case	Package / Case [y]	Memory Interface	Memory Organization	Supplier Device Package	Technology	Voltage - Supply [Min]	Voltage - Supply [Max]	Clock Frequency	Access Time	Mounting Type	Memory Type
Winbond Electronics W25M02GVSFJR	700 µs	2 Gbit	FLASH	105 °C	-40 °C	0.295 in	16-SOIC	7.5 mm	SPI - Quad I/O	256M x 8	16-SOIC	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVZEJR	700 µs	2 Gbit	FLASH	105 °C	-40 °C		8-WDFN Exposed Pad		SPI - Quad I/O	256M x 8	8-WSON (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVSFJT	700 µs	2 Gbit	FLASH	105 °C	-40 °C	0.295 in	16-SOIC	7.5 mm	SPI - Quad I/O	256M x 8	16-SOIC	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTCIT TR	700 µs	2 Gbit	FLASH	85 °C	-40 °C		24-TBGA		SPI	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz		Surface Mount	Non-Volatile
Winbond Electronics W25M02GVZEIR	700 µs	2 Gbit	FLASH	85 °C	-40 °C		8-WDFN Exposed Pad		SPI - Quad I/O	256M x 8	8-WSON (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVSFIR	700 µs	2 Gbit	FLASH	85 °C	-40 °C	0.295 in	16-SOIC	7.5 mm	SPI - Quad I/O	256M x 8	16-SOIC	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTBIG TR	700 µs	2 Gbit	FLASH	85 °C	-40 °C		24-TBGA		SPI	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz		Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTBJT	700 µs	2 Gbit	FLASH	105 °C	-40 °C		24-TBGA		SPI - Quad I/O	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTCJT	700 µs	2 Gbit	FLASH	105 °C	-40 °C		24-TBGA		SPI - Quad I/O	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile
Winbond Electronics W25M02GVTBIR	700 µs	2 Gbit	FLASH	85 °C	-40 °C		24-TBGA		SPI - Quad I/O	256M x 8	24-TFBGA (8x6)	FLASH - NAND (SLC)	2.7 V	3.6 V	104 MHz	7 ns	Surface Mount	Non-Volatile

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$