IC FLASH 2GBIT SPI/QUAD 16SOIC
| Part | Write Cycle Time - Word, Page | Memory Size | Memory Format | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case [x] | Package / Case | Package / Case [y] | Memory Interface | Memory Organization | Supplier Device Package | Technology | Voltage - Supply [Min] | Voltage - Supply [Max] | Clock Frequency | Access Time | Mounting Type | Memory Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 105 °C | -40 °C | 0.295 in | 16-SOIC | 7.5 mm | SPI - Quad I/O | 256M x 8 | 16-SOIC | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | 7 ns | Surface Mount | Non-Volatile |
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 105 °C | -40 °C | 8-WDFN Exposed Pad | SPI - Quad I/O | 256M x 8 | 8-WSON (8x6) | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | 7 ns | Surface Mount | Non-Volatile | ||
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 105 °C | -40 °C | 0.295 in | 16-SOIC | 7.5 mm | SPI - Quad I/O | 256M x 8 | 16-SOIC | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | 7 ns | Surface Mount | Non-Volatile |
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 85 °C | -40 °C | 24-TBGA | SPI | 256M x 8 | 24-TFBGA (8x6) | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | Surface Mount | Non-Volatile | |||
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 85 °C | -40 °C | 8-WDFN Exposed Pad | SPI - Quad I/O | 256M x 8 | 8-WSON (8x6) | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | 7 ns | Surface Mount | Non-Volatile | ||
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 85 °C | -40 °C | 0.295 in | 16-SOIC | 7.5 mm | SPI - Quad I/O | 256M x 8 | 16-SOIC | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | 7 ns | Surface Mount | Non-Volatile |
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 85 °C | -40 °C | 24-TBGA | SPI | 256M x 8 | 24-TFBGA (8x6) | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | Surface Mount | Non-Volatile | |||
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 105 °C | -40 °C | 24-TBGA | SPI - Quad I/O | 256M x 8 | 24-TFBGA (8x6) | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | 7 ns | Surface Mount | Non-Volatile | ||
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 105 °C | -40 °C | 24-TBGA | SPI - Quad I/O | 256M x 8 | 24-TFBGA (8x6) | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | 7 ns | Surface Mount | Non-Volatile | ||
Winbond Electronics | 700 µs | 2 Gbit | FLASH | 85 °C | -40 °C | 24-TBGA | SPI - Quad I/O | 256M x 8 | 24-TFBGA (8x6) | FLASH - NAND (SLC) | 2.7 V | 3.6 V | 104 MHz | 7 ns | Surface Mount | Non-Volatile |