W25Q256FVCIP

Unknown

Winbond Electronics

IC FLASH 256MBIT SPI 24TFBGA

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

W25Q256FVCIP

Unknown

Winbond Electronics

IC FLASH 256MBIT SPI 24TFBGA

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	W25Q256FVCIP

Clock Frequency	104 MHz
Memory Format	FLASH
Memory Interface	Quad I/O, QPI, SPI
Memory Organization	32 M
Memory Size	256 Gbit
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	24-TBGA
Supplier Device Package	24-TFBGA (6x8)
Technology	FLASH - NOR
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	2.7 V
Write Cycle Time - Word, Page [custom]	3 ms
Write Cycle Time - Word, Page [custom]	50 µs

W25Q256 Series

Part	Write Cycle Time - Word, Page [custom]	Write Cycle Time - Word, Page [custom]	Mounting Type	Memory Organization	Memory Type	Clock Frequency	Memory Interface	Supplier Device Package	Memory Format	Package / Case	Technology	Memory Size	Operating Temperature [Max]	Operating Temperature [Min]	Voltage - Supply [Min]	Voltage - Supply [Max]	Package / Case [x]	Package / Case [y]	Write Cycle Time - Word, Page	Access Time
Winbond Electronics W25Q256FVCJQ	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	24-TFBGA (6x8)	FLASH	24-TBGA	FLASH - NOR	256 Gbit	105 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256JVFJM TR			Surface Mount	32 M	Non-Volatile	133 MHz	SPI - Quad I/O	16-SOIC	FLASH	16-SOIC	FLASH - NOR	256 Gbit	105 °C	-40 °C	2.7 V	3.6 V	0.295 in	7.5 mm	3 ms
Winbond Electronics W25Q256FVEIP TR	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	8-WSON (8x6)	FLASH	8-WDFN Exposed Pad	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256JVMIM			Surface Mount	32 M	Non-Volatile	133 MHz	SPI - Quad I/O	8-WFLGA (6x5)	FLASH	8-WLGA Exposed Pad	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V			3 ms	6 ns
Winbond Electronics W25Q256FVBIP	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	24-TFBGA (6x8)	FLASH	24-TBGA	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256JVCJM			Surface Mount	32 M	Non-Volatile	133 MHz	SPI - Quad I/O	24-TFBGA (6x8)	FLASH	24-TBGA	FLASH - NOR	256 Gbit	105 °C	-40 °C	2.7 V	3.6 V			3 ms
Winbond Electronics W25Q256FVEIG	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	8-WSON (8x6)	FLASH	8-WDFN Exposed Pad	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256JVEJM TR			Surface Mount	32 M	Non-Volatile	133 MHz	SPI - Quad I/O	8-WSON (8x6)	FLASH	8-WDFN Exposed Pad	FLASH - NOR	256 Gbit	105 °C	-40 °C	2.7 V	3.6 V			3 ms
Winbond Electronics W25Q256FVCIP	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	24-TFBGA (6x8)	FLASH	24-TBGA	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256FVFIQ	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	16-SOIC	FLASH	16-SOIC	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V	0.295 in	7.5 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

W25Q256 Series

FLASH - NOR Memory IC 256Mbit SPI - Quad I/O, QPI 104 MHz 24-TFBGA (6x8)

Documents

Technical documentation and resources