IC FLASH 256MBIT SPI 24TFBGA
| Part | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Mounting Type | Memory Organization | Memory Type | Clock Frequency | Memory Interface | Supplier Device Package | Memory Format | Package / Case | Technology | Memory Size | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Supply [Min] | Voltage - Supply [Max] | Package / Case [x] | Package / Case [y] | Write Cycle Time - Word, Page | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 3 ms | 50 µs | Surface Mount | 32 M | Non-Volatile | 104 MHz | QPI Quad I/O SPI | 24-TFBGA (6x8) | FLASH | 24-TBGA | FLASH - NOR | 256 Gbit | 105 °C | -40 °C | 2.7 V | 3.6 V | ||||
Winbond Electronics | Surface Mount | 32 M | Non-Volatile | 133 MHz | SPI - Quad I/O | 16-SOIC | FLASH | 16-SOIC | FLASH - NOR | 256 Gbit | 105 °C | -40 °C | 2.7 V | 3.6 V | 0.295 in | 7.5 mm | 3 ms | |||
Winbond Electronics | 3 ms | 50 µs | Surface Mount | 32 M | Non-Volatile | 104 MHz | QPI Quad I/O SPI | 8-WSON (8x6) | FLASH | 8-WDFN Exposed Pad | FLASH - NOR | 256 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | ||||
Winbond Electronics | Surface Mount | 32 M | Non-Volatile | 133 MHz | SPI - Quad I/O | 8-WFLGA (6x5) | FLASH | 8-WLGA Exposed Pad | FLASH - NOR | 256 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 3 ms | 6 ns | ||||
Winbond Electronics | 3 ms | 50 µs | Surface Mount | 32 M | Non-Volatile | 104 MHz | QPI Quad I/O SPI | 24-TFBGA (6x8) | FLASH | 24-TBGA | FLASH - NOR | 256 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | ||||
Winbond Electronics | Surface Mount | 32 M | Non-Volatile | 133 MHz | SPI - Quad I/O | 24-TFBGA (6x8) | FLASH | 24-TBGA | FLASH - NOR | 256 Gbit | 105 °C | -40 °C | 2.7 V | 3.6 V | 3 ms | |||||
Winbond Electronics | 3 ms | 50 µs | Surface Mount | 32 M | Non-Volatile | 104 MHz | QPI Quad I/O SPI | 8-WSON (8x6) | FLASH | 8-WDFN Exposed Pad | FLASH - NOR | 256 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | ||||
Winbond Electronics | Surface Mount | 32 M | Non-Volatile | 133 MHz | SPI - Quad I/O | 8-WSON (8x6) | FLASH | 8-WDFN Exposed Pad | FLASH - NOR | 256 Gbit | 105 °C | -40 °C | 2.7 V | 3.6 V | 3 ms | |||||
Winbond Electronics | 3 ms | 50 µs | Surface Mount | 32 M | Non-Volatile | 104 MHz | QPI Quad I/O SPI | 24-TFBGA (6x8) | FLASH | 24-TBGA | FLASH - NOR | 256 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | ||||
Winbond Electronics | 3 ms | 50 µs | Surface Mount | 32 M | Non-Volatile | 104 MHz | QPI Quad I/O SPI | 16-SOIC | FLASH | 16-SOIC | FLASH - NOR | 256 Gbit | 85 °C | -40 °C | 2.7 V | 3.6 V | 0.295 in | 7.5 mm |