W25Q256JVEJM TR

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Winbond Electronics

IC FLASH 256MBIT SPI/QUAD 8WSON

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W25Q256JVEJM TR

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Winbond Electronics

IC FLASH 256MBIT SPI/QUAD 8WSON

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	W25Q256JVEJM TR

Clock Frequency	133 MHz
Memory Format	FLASH
Memory Interface	SPI - Quad I/O
Memory Organization	32 M
Memory Size	256 Gbit
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Package / Case	8-WDFN Exposed Pad
Supplier Device Package	8-WSON (8x6)
Technology	FLASH - NOR
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	2.7 V
Write Cycle Time - Word, Page	3 ms

W25Q256 Series

Part	Write Cycle Time - Word, Page [custom]	Write Cycle Time - Word, Page [custom]	Mounting Type	Memory Organization	Memory Type	Clock Frequency	Memory Interface	Supplier Device Package	Memory Format	Package / Case	Technology	Memory Size	Operating Temperature [Max]	Operating Temperature [Min]	Voltage - Supply [Min]	Voltage - Supply [Max]	Package / Case [x]	Package / Case [y]	Write Cycle Time - Word, Page	Access Time
Winbond Electronics W25Q256FVCJQ	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	24-TFBGA (6x8)	FLASH	24-TBGA	FLASH - NOR	256 Gbit	105 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256JVFJM TR			Surface Mount	32 M	Non-Volatile	133 MHz	SPI - Quad I/O	16-SOIC	FLASH	16-SOIC	FLASH - NOR	256 Gbit	105 °C	-40 °C	2.7 V	3.6 V	0.295 in	7.5 mm	3 ms
Winbond Electronics W25Q256FVEIP TR	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	8-WSON (8x6)	FLASH	8-WDFN Exposed Pad	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256JVMIM			Surface Mount	32 M	Non-Volatile	133 MHz	SPI - Quad I/O	8-WFLGA (6x5)	FLASH	8-WLGA Exposed Pad	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V			3 ms	6 ns
Winbond Electronics W25Q256FVBIP	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	24-TFBGA (6x8)	FLASH	24-TBGA	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256JVCJM			Surface Mount	32 M	Non-Volatile	133 MHz	SPI - Quad I/O	24-TFBGA (6x8)	FLASH	24-TBGA	FLASH - NOR	256 Gbit	105 °C	-40 °C	2.7 V	3.6 V			3 ms
Winbond Electronics W25Q256FVEIG	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	8-WSON (8x6)	FLASH	8-WDFN Exposed Pad	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256JVEJM TR			Surface Mount	32 M	Non-Volatile	133 MHz	SPI - Quad I/O	8-WSON (8x6)	FLASH	8-WDFN Exposed Pad	FLASH - NOR	256 Gbit	105 °C	-40 °C	2.7 V	3.6 V			3 ms
Winbond Electronics W25Q256FVCIP	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	24-TFBGA (6x8)	FLASH	24-TBGA	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V
Winbond Electronics W25Q256FVFIQ	3 ms	50 µs	Surface Mount	32 M	Non-Volatile	104 MHz	QPI Quad I/O SPI	16-SOIC	FLASH	16-SOIC	FLASH - NOR	256 Gbit	85 °C	-40 °C	2.7 V	3.6 V	0.295 in	7.5 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

W25Q256 Series

FLASH - NOR Memory IC 256Mbit SPI - Quad I/O 133 MHz 8-WSON (8x6)

Documents

Technical documentation and resources