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1 SHIELDED GOLD PHOSPHOR BRONZE WITHLED 0℃~+70℃ PLUGIN ETHERNET CONNECTORS / MODULAR CONNECTORS (RJ45 RJ11) ROHS
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Height Above Board | Height Above Board | Number of Cores per Jack | Mounting Type | Tab Direction | Number of Ports | Contact Finish | Termination | Shield Material | Housing Material | Contact Material | Connector Type | Contact Finish Thickness | Contact Finish Thickness | Number of Rows | Orientation | Shielding | Applications | LED Color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EDAC Inc. | 70 °C | 0 °C | 0.532 in | 13.51 mm | 8 | Through Hole | Up | 1 | Gold | Solder | Copper Alloy | Nylon Polyamide (PA) Polyester Glass Filled | Phosphor Bronze | RJ45 | 15 µin | 0.38 µm | 1 | 90 ° | Shielded EMI Finger | 10/100/1000 Base-T AutoMDIX | Green Yellow |
EDAC Inc. | 70 °C | 0 °C | 0.535 in | 13.59 mm | 8 | Through Hole | Down | 1 | Gold | Solder | Copper Alloy | Polybutylene Terephthalate (PBT) Glass Filled | Phosphor Bronze | RJ45 | 15 µin | 0.38 µm | 1 | 90 ° | Shielded EMI Finger | 10/100/1000 Base-T AutoMDIX | Green Yellow |
EDAC Inc. | 70 °C | 0 °C | 0.53 in | 13.45 mm | 8 | Through Hole | Up | 1 | Gold | Solder | Copper Alloy | Nylon Polyamide (PA) Polyester | Phosphor Bronze | RJ45 | 15 µin | 0.38 µm | 1 | 90 ° | Shielded EMI Finger | 10/100/1000 Base-T AutoMDIX | Green Orange - Yellow |
EDAC Inc. | 70 °C | 0 °C | 0.535 in | 13.59 mm | 8 | Through Hole | Down | 1 | Gold | Solder | Copper Alloy | Polybutylene Terephthalate (PBT) Glass Filled | Phosphor Bronze | RJ45 | 15 µin | 0.38 µm | 1 | 90 ° | Shielded EMI Finger | 10/100/1000 Base-T AutoMDIX | Does Not Contain LED |
EDAC Inc. | 70 °C | 0 °C | 0.532 in | 13.51 mm | 8 | Through Hole | Up | 1 | Gold | Solder | Copper Alloy | Nylon Polyamide (PA) Polyester Glass Filled | Phosphor Bronze | RJ45 | 15 µin | 0.38 µm | 1 | 90 ° | Shielded EMI Finger | 10/100/1000 Base-T AutoMDIX | Green - Green Yellow |