CONN HDR 20POS SMD GOLD
| Part | Height Above Board [z] | Height Above Board [z] | Contact Finish Thickness | Contact Finish Thickness | Features | Number of Rows | Pitch [x] | Pitch [x] | Contact Finish | Mounting Type | Mated Stacking Heights | Number of Positions | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric USA, Inc. | 0.11 " | 2.8 mm | 8 çin | 0.203 çm | Board Guide Solder Retention | 2 | 0.5 mm | 0.02 in | Gold | Surface Mount | 3.5 mm | 20 | Header Outer Shroud Contacts |
Hirose Electric USA, Inc. | 0.11 " | 2.8 mm | 8 çin | 0.203 çm | Board Guide Solder Retention | 2 | 0.5 mm | 0.02 in | Gold | Surface Mount | 3.5 mm | 40 | Header Outer Shroud Contacts |
Hirose Electric USA, Inc. | 0.11 " | 2.8 mm | 8 çin | 0.203 çm | Board Guide Solder Retention | 2 | 0.5 mm | 0.02 in | Gold | Surface Mount | 3.5 mm | 30 | Header Outer Shroud Contacts |
Hirose Electric USA, Inc. | 0.11 " | 2.8 mm | 8 çin | 0.203 çm | Board Guide Solder Retention | 2 | 0.5 mm | 0.02 in | Gold | Surface Mount | 3.5 mm | 36 | Header Outer Shroud Contacts |
Hirose Electric USA, Inc. | 0.11 " | 2.8 mm | Board Guide Solder Retention | 2 | 0.5 mm | 0.02 in | Gold | Surface Mount | 3.5 mm | 40 | Header Outer Shroud Contacts | ||
Hirose Electric USA, Inc. | 0.11 " | 2.8 mm | Board Guide Solder Retention | 2 | 0.5 mm | 0.02 in | Gold | Surface Mount | 3.5 mm | 36 | Header Outer Shroud Contacts |