Beta
⌘K
CONN EDGE SINGLE FML 10POS 0.100
| Part | Read Out | Pitch [x] | Pitch [x] | Termination Rows | Card Thickness [Min] | Card Thickness [Min] | Card Thickness [Max] | Card Thickness [Max] | Contact Finish | Color | Number of Positions/Bay/Row [custom] | Gender | Termination | Card Type | Contact Finish Thickness | Contact Finish Thickness | Contact Type | Number of Positions | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material | Mounting Type | Flange Feature [diameter] | Flange Feature | Flange Feature [diameter] | Material - Insulation | Number of Rows | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EDAC Inc. | Single | 2.54 mm | 0.1 in | 1 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 10 | Female | Solder Eyelet(s) | Non Specified - Single Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Through Hole | 0.116 in | Floating Bobbin Flush Mount | 2.95 mm | Polyphenylene Sulfide (PPS) | 1 | |
EDAC Inc. | Dual | 2.54 mm | 0.1 in | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 5 | Female | Solder | Non Specified - Dual Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Through Hole | 0.156 in | Flush Mount Top Opening Unthreaded | 3.96 mm | Polyphenylene Sulfide (PPS) | 2 | |
EDAC Inc. | Dual | 2.54 mm | 0.1 in | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 5 | Female | Solder | Non Specified - Dual Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Through Hole | 0.128 " | Flush Mount Side Opening Unthreaded | 3.25 mm | Polyphenylene Sulfide (PPS) | 2 | |
EDAC Inc. | Single | 2.54 mm | 0.1 in | 1 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 10 | Female | Wire Wrap | Non Specified - Single Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Through Hole | Flush Mount M3 Threaded Insert Top Opening | Polyphenylene Sulfide (PPS) | 1 | |||
EDAC Inc. | Single | 2.54 mm | 0.1 in | 1 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 10 | Female | Solder | Non Specified - Single Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Through Hole | 0.116 in | Floating Bobbin Flush Mount | 2.95 mm | Polyphenylene Sulfide (PPS) | 1 | |
EDAC Inc. | Dual | 2.54 mm | 0.1 in | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 5 | Female | Solder | Non Specified - Dual Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Board Edge Straddle Mount | 0.128 " | Flush Mount Side Opening Unthreaded | 3.25 mm | Polyphenylene Sulfide (PPS) | 2 | Card Extender |
EDAC Inc. | Dual | 2.54 mm | 0.1 in | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 5 | Female | Solder | Non Specified - Dual Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Board Edge Straddle Mount | 0.156 in | Flush Mount Top Opening Unthreaded | 3.96 mm | Polyphenylene Sulfide (PPS) | 2 | Card Extender |
EDAC Inc. | Single | 2.54 mm | 0.1 in | 1 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 10 | Female | Solder Eyelet(s) | Non Specified - Single Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Through Hole | 0.128 " | Flush Mount Top Opening Unthreaded | 3.25 mm | Polyphenylene Sulfide (PPS) | 1 | |
EDAC Inc. | Single | 2.54 mm | 0.1 in | 1 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 10 | Female | Solder Eyelet(s) | Non Specified - Single Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Through Hole | Flush Mount M3 Threaded Insert Top Opening | Polyphenylene Sulfide (PPS) | 1 | |||
EDAC Inc. | Single | 2.54 mm | 0.1 in | 1 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Gold | Black | 10 | Female | Solder | Non Specified - Single Edge | 10 Áin | 0.25 Ám | Cantilever | 10 | 125 °C | -40 °C | Copper Alloy | Through Hole | Polyphenylene Sulfide (PPS) | 1 |