CONN SOCKET 10POS SMD GOLD
| Part | Features | Height Above Board [z] | Height Above Board [z] | Pitch [x] | Pitch [x] | Number of Positions | Contact Finish | Mated Stacking Heights | Number of Rows | Mounting Type | Connector Type | Height Above Board | Height Above Board | Number of Positions [custom] | Number of Positions [custom] | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric USA, Inc. | Solder Retention | 0.8 mm | 0.031 in | 0.35 mm | 0.014 in | 12 | Gold | 0.8 mm | 2 | Surface Mount | Socket Center Strip Contacts | ||||||
Hirose Electric USA, Inc. | Solder Retention | 0.8 mm | 0.031 in | 0.35 mm | 0.014 in | Gold | 0.8 mm | 2 | Surface Mount | Socket Center Strip Contacts | |||||||
Hirose Electric USA, Inc. | Solder Retention | 0.35 mm | 0.014 in | 12 | Gold | 0.8 mm | 2 | Surface Mount | Header Outer Shroud Contacts | 0.026 in | 0.65 mm | ||||||
Hirose Electric USA, Inc. | Solder Retention | 0.8 mm | 0.031 in | 0.35 mm | 0.014 in | 12 | Gold | 0.8 mm | 2 | Surface Mount | Socket Center Strip Contacts | ||||||
Hirose Electric USA, Inc. | Solder Retention | 0.35 mm | 0.014 in | Gold | 0.8 mm | 2 | Surface Mount | Header Outer Shroud Contacts | 0.026 in | 0.65 mm | 30 | 2 | |||||
Hirose Electric USA, Inc. | Solder Retention | 0.8 mm | 0.031 in | 0.35 mm | 0.014 in | 52 | Gold | 2 | Surface Mount | Socket Center Strip Contacts | 2 | 1.97 Áin | 0.05 Ám | ||||
Hirose Electric USA, Inc. | Solder Retention | 0.35 mm | 0.014 in | 52 | Gold | 0.8 mm | 2 | Surface Mount | Header Outer Shroud Contacts | 0.026 in | 0.65 mm | 2 | 1.97 Áin | 0.05 Ám | |||
Hirose Electric USA, Inc. | Solder Retention | 0.8 mm | 0.031 in | 0.35 mm | 0.014 in | Gold | 0.8 mm | 2 | Surface Mount | Socket Center Strip Contacts | 40 | 2 |