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SCT3080KRHRC15 - Product thumbnail image

SCT3080KRHRC15

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Rohm Semiconductor

1200V, 31A, 4-PIN THD, TRENCH-STRUCTURE, SILICON-CARBIDE (SIC) MOSFET FOR AUTOMOTIVE

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SCT3080KRHRC15 - Product thumbnail image

SCT3080KRHRC15

Active
Rohm Semiconductor

1200V, 31A, 4-PIN THD, TRENCH-STRUCTURE, SILICON-CARBIDE (SIC) MOSFET FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationSCT3080KRHRC15
Current - Continuous Drain (Id) @ 25°C31 A
Drain to Source Voltage (Vdss)1200 V
Drive Voltage (Max Rds On, Min Rds On)18 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs60 nC, 18 V
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds785 pF
Mounting TypeThrough Hole
Operating Temperature175 °C
Package / CaseTO-247-4
Power Dissipation (Max) [Max]165 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs104 mOhm
Supplier Device PackageTO-247-4L
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id [Max]5.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 14.20
10$ 10.05
450$ 8.87
NewarkEach 1$ 16.81
10$ 15.27
25$ 14.77
50$ 14.28
100$ 13.78
250$ 13.48
900$ 13.47

Description

General part information

SCT3080KRHR Series

SCT3080KR is anSiC MOSFETfeaturing a trench gate structure optimized for server power supplies, solar power inverters, andEV charging stationsrequiring high efficiency. A new 4-pin package is used that separates the power and driver source terminals, making it possible to maximize high-speed switching performance. This improves turn ON loss in particular, and as a result the total turn ON and turn OFF losses can be reduced by as much as 35% compared with the conventional 3-pin package (TO-247N).A pioneer and industry leader in SiC technology, ROHM was the first supplier to mass produce trench-type MOSFETs that further improve efficiency while reducing power consumption over existing SiC MOSFETs.

Documents

Technical documentation and resources

Best practices for the connection of Driver Source/Emitter terminals in discrete devices

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Basics and Design Guidelines for Gate Drive Circuits

Schematic Design & Verification

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Types and Features of Transistors

Application Note

5kW High-Efficiency Fan-less Inverter

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use PLECS Models

Technical Article

SiC MOSFET Layout Design Considerations

Technical Article

SCT3080KRHR Data Sheet

Data Sheet

About Export Administration Regulations (EAR)

Export Information

What Is Thermal Design

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

TO-247-4L_C15 Dimensions

Package Information

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

Snubber circuit design methods for SiC MOSFET

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions during gate-source voltage measurement for SiC MOSFET

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Anti-Whisker formation

Package Information

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Solving the challenges of driving SiC MOSFETs with new packaging developments

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Calculating Power Loss from Measured Waveforms

Schematic Design & Verification

Gate-Source Voltage Surge Suppression Methods

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Technical Data Sheet EN

Datasheet

Datasheet

Datasheet