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SCT3080ALGC11 - Product dimension image

SCT3080ALGC11

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 30 A, 650 V, 0.08 OHM, TO-247N

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SCT3080ALGC11 - Product dimension image

SCT3080ALGC11

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 30 A, 650 V, 0.08 OHM, TO-247N

Technical Specifications

Parameters and characteristics for this part

SpecificationSCT3080ALGC11
Current - Continuous Drain (Id) @ 25°C30 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)18 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs48 nC
Input Capacitance (Ciss) (Max) @ Vds571 pF
Mounting TypeThrough Hole
Operating Temperature175 °C
Package / CaseTO-247-3
Power Dissipation (Max) [Max]134 W
Rds On (Max) @ Id, Vgs104 mOhm
Supplier Device PackageTO-247N
Vgs(th) (Max) @ Id [Max]5.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 11.97
30$ 9.56
120$ 8.55
510$ 7.54
1020$ 6.79
NewarkEach 1$ 10.14
10$ 9.68
25$ 9.38
60$ 8.89

Description

General part information

SCT3080KRHR Series

SCT3080KR is anSiC MOSFETfeaturing a trench gate structure optimized for server power supplies, solar power inverters, andEV charging stationsrequiring high efficiency. A new 4-pin package is used that separates the power and driver source terminals, making it possible to maximize high-speed switching performance. This improves turn ON loss in particular, and as a result the total turn ON and turn OFF losses can be reduced by as much as 35% compared with the conventional 3-pin package (TO-247N).A pioneer and industry leader in SiC technology, ROHM was the first supplier to mass produce trench-type MOSFETs that further improve efficiency while reducing power consumption over existing SiC MOSFETs.

Documents

Technical documentation and resources

Compliance of the ELV directive

Environmental Data

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

About Flammability of Materials

Environmental Data

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Precautions during gate-source voltage measurement for SiC MOSFET

Schematic Design & Verification

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Gate-Source Voltage Surge Suppression Methods

Schematic Design & Verification

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

5kW High-Efficiency Fan-less Inverter

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

ESD Data

Characteristics Data

Calculating Power Loss from Measured Waveforms

Schematic Design & Verification

Solving the challenges of driving SiC MOSFETs with new packaging developments

White Paper

Basics and Design Guidelines for Gate Drive Circuits

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

SiC MOSFET Layout Design Considerations

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Create Symbols for PSpice Models

Models

Package Dimensions

Package Information

About Export Administration Regulations (EAR)

Export Information

What Is Thermal Design

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Taping Information

Package Information

Anti-Whisker formation

Package Information

Snubber circuit design methods for SiC MOSFET

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Inner Structure

Package Information

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Explanation for Marking

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Reliability Test Result

Manufacturing Data

How to Use PLECS Models

Technical Article

Best practices for the connection of Driver Source/Emitter terminals in discrete devices

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

PCB Layout Thermal Design Guide

Thermal Design

SiC Flammability

Related Document

TO-247N Taping Spec

Datasheet