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42-3572-16 - Product Image

42-3572-16

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Aries Electronics

42P DIP NICKEL BORON BERYLLIUM NICKEL 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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42-3572-16 - Product Image

42-3572-16

Active
Aries Electronics

42P DIP NICKEL BORON BERYLLIUM NICKEL 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification42-3572-16
Contact Finish - MatingNickel Boron
Contact Finish - PostNickel Boron
Contact Finish Thickness - Mating1.27 µm
Contact Finish Thickness - Mating50 µin
Contact Finish Thickness - Post1.27 µm
Contact Finish Thickness - Post50 µin
Contact Material - MatingBeryllium Nickel
Contact Material - PostBeryllium Nickel
Current Rating (Amps)1 A
FeaturesClosed Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)42
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length0.11 in
Termination Post Length2.78 mm
Type7.62 mm
Type0.3 in
TypeDIP, ZIF (ZIP)

42-3572 Series

PartContact Finish - PostTerminationContact Finish Thickness - MatingContact Finish Thickness - MatingTypeTypeTypeContact Finish Thickness - PostContact Finish Thickness - PostPitch - MatingPitch - MatingContact Material - MatingTermination Post LengthTermination Post LengthFeaturesContact Material - PostMaterial Flammability RatingCurrent Rating (Amps)Number of Positions or Pins (Grid)Pitch - PostPitch - PostMounting TypeHousing MaterialContact Finish - Mating
Aries Electronics
Tin
Solder
5.08 µm
200 µin
7.62 mm
0.3 in
DIP
ZIF (ZIP)
200 µin
5.08 µm
0.1 in
2.54 mm
Beryllium Copper
0.11 in
2.78 mm
Closed Frame
Beryllium Copper
UL94 V-0
1 A
42
2.54 mm
0.1 in
Through Hole
Polyphenylene Sulfide (PPS)
Glass Filled
Aries Electronics
Nickel Boron
Solder
1.27 µm
50 µin
7.62 mm
0.3 in
DIP
ZIF (ZIP)
50 µin
1.27 µm
0.1 in
2.54 mm
Beryllium Nickel
0.11 in
2.78 mm
Closed Frame
Beryllium Nickel
UL94 V-0
1 A
42
2.54 mm
0.1 in
Through Hole
Polyphenylene Sulfide (PPS)
Glass Filled
Nickel Boron
Aries Electronics
Gold
Solder
0.25 çm
10 çin
7.62 mm
0.3 in
DIP
ZIF (ZIP)
10 çin
0.25 çm
0.1 in
2.54 mm
Beryllium Copper
0.11 in
2.78 mm
Closed Frame
Beryllium Copper
UL94 V-0
1 A
42
2.54 mm
0.1 in
Through Hole
Polyphenylene Sulfide (PPS)
Glass Filled
Gold

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 6$ 79.48
LCSCPiece 1$ 148.16
200$ 59.12
500$ 57.14
1000$ 56.17

Description

General part information

42-3572 Series

42 (2 x 21) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole

Documents

Technical documentation and resources