42-3572 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Contact Finish - Post	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Termination Post Length	Termination Post Length	Features	Contact Material - Post	Material Flammability Rating	Current Rating (Amps)	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Mounting Type	Housing Material	Contact Finish - Mating
Aries Electronics 42-3572-10	Tin	Solder	5.08 µm	200 µin	7.62 mm	0.3 in	DIP ZIF (ZIP)	200 µin	5.08 µm	0.1 in	2.54 mm	Beryllium Copper	0.11 in	2.78 mm	Closed Frame	Beryllium Copper	UL94 V-0	1 A	42	2.54 mm	0.1 in	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 42-3572-16	Nickel Boron	Solder	1.27 µm	50 µin	7.62 mm	0.3 in	DIP ZIF (ZIP)	50 µin	1.27 µm	0.1 in	2.54 mm	Beryllium Nickel	0.11 in	2.78 mm	Closed Frame	Beryllium Nickel	UL94 V-0	1 A	42	2.54 mm	0.1 in	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron
Aries Electronics 42-3572-11	Gold	Solder	0.25 çm	10 çin	7.62 mm	0.3 in	DIP ZIF (ZIP)	10 çin	0.25 çm	0.1 in	2.54 mm	Beryllium Copper	0.11 in	2.78 mm	Closed Frame	Beryllium Copper	UL94 V-0	1 A	42	2.54 mm	0.1 in	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Gold