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2SAR567F3TR - Product dimension image

2SAR567F3TR

Active
Rohm Semiconductor

SMALL SIGNAL BIPOLAR TRANSISTOR, 2.5A I(C), 120V V(BR)CEO, 1-ELEMENT, PNP, SILICON, DFN2020, 3 PIN

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2SAR567F3TR - Product dimension image

2SAR567F3TR

Active
Rohm Semiconductor

SMALL SIGNAL BIPOLAR TRANSISTOR, 2.5A I(C), 120V V(BR)CEO, 1-ELEMENT, PNP, SILICON, DFN2020, 3 PIN

Technical Specifications

Parameters and characteristics for this part

Specification2SAR567F3TR
Current - Collector (Ic) (Max) [Max]2.5 A
Current - Collector Cutoff (Max) [Max]1 µA
DC Current Gain (hFE) (Min) @ Ic, Vce120 hFE
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case3-UDFN Exposed Pad
Power - Max [Max]1 W
Supplier Device PackageHUML2020L3
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic200 mV
Voltage - Collector Emitter Breakdown (Max) [Max]120 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.78
10$ 1.13
100$ 0.76
500$ 0.60
1000$ 0.55
Digi-Reel® 1$ 1.78
10$ 1.13
100$ 0.76
500$ 0.60
1000$ 0.55
Tape & Reel (TR) 3000$ 0.44
NewarkEach (Supplied on Cut Tape) 1$ 1.84
10$ 1.18
25$ 1.04
50$ 0.91
100$ 0.78
250$ 0.70
500$ 0.62
1000$ 0.56

Description

General part information

2SAR567F3 Series

2SAR567F3 is a middle power transistor with Low VCE(sat), suitable for low frequency amplifier. HUML2020L3 (DFN2020-3S) is a small leadless surface mount package with excellent thermal and electrical conductivity.

Documents

Technical documentation and resources

Moisture Sensitivity Level - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Package Dimensions

Package Information

PCB Layout Thermal Design Guide

Thermal Design

About Export Regulations

Export Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

2SAR567F3 Thermal Resistance

Characteristics Data

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Create Symbols for PSpice Models

Models

2SAR567F3 ESD Data

Characteristics Data

Explanation for Marking

Package Information

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Inner Structure

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design