W25Q32FVZEBQ

Obsolete

Winbond Electronics

IC FLASH 32MBIT SPI/QUAD 8WSON

Deep-Dive with AI

Search across all available documentation for this part.

W25Q32FVZEBQ

Obsolete

Winbond Electronics

IC FLASH 32MBIT SPI/QUAD 8WSON

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	W25Q32FVZEBQ

Access Time	7 ns
Clock Frequency	104 MHz
Memory Format	FLASH
Memory Interface	Quad I/O, QPI, SPI
Memory Organization	4M x 8
Memory Size	32 Gbit
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	8-WDFN Exposed Pad
Supplier Device Package	8-WSON (8x6)
Technology	FLASH - NOR
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	2.7 V
Write Cycle Time - Word, Page [custom]	3 ms
Write Cycle Time - Word, Page [custom]	50 µs

W25Q32 Series

...

Part	Operating Temperature [Max]	Operating Temperature [Min]	Voltage - Supply [Min]	Voltage - Supply [Max]	Package / Case	Supplier Device Package	Memory Interface	Mounting Type	Memory Size	Technology	Write Cycle Time - Word, Page [custom]	Write Cycle Time - Word, Page [custom]	Clock Frequency	Memory Organization	Memory Format	Memory Type	Write Cycle Time - Word, Page	Access Time	Package / Case [x]	Package / Case [y]
Winbond Electronics W25Q32FVTCJF	105 °C	-40 °C	2.7 V	3.6 V	24-TBGA	24-TFBGA (8x6)	QPI Quad I/O SPI	Surface Mount	32 Gbit	FLASH - NOR	3 ms	50 µs	104 MHz	4M x 8	FLASH	Non-Volatile
Winbond Electronics W25Q32JVSFIM	85 °C	-40 °C	2.7 V	3.6 V	16-SOIC	16-SOIC	DTR QPI Quad I/O SPI	Surface Mount	32 Gbit	FLASH - NOR			133 MHz	4M x 8	FLASH	Non-Volatile	3 ms	6 ns	0.295 in	7.5 mm
Winbond Electronics W25Q32FVTBJQ	105 °C	-40 °C	2.7 V	3.6 V	24-TBGA	24-TFBGA (8x6)	QPI Quad I/O SPI	Surface Mount	32 Gbit	FLASH - NOR	3 ms	50 µs	104 MHz	4M x 8	FLASH	Non-Volatile
Winbond Electronics W25Q32FVZEBQ	85 °C	-40 °C	2.7 V	3.6 V	8-WDFN Exposed Pad	8-WSON (8x6)	QPI Quad I/O SPI	Surface Mount	32 Gbit	FLASH - NOR	3 ms	50 µs	104 MHz	4M x 8	FLASH	Non-Volatile		7 ns
Winbond Electronics W25Q32JVTBIQ	85 °C	-40 °C	2.7 V	3.6 V	24-TBGA	24-TFBGA (8x6)	SPI - Quad I/O	Surface Mount	32 Gbit	FLASH - NOR			133 MHz	4M x 8	FLASH	Non-Volatile	3 ms
Winbond Electronics W25Q32JVXGIQ TR	85 °C	-40 °C	2.7 V	3.6 V	8-XDFN Exposed Pad	8-XSON (4x4)	SPI - Quad I/O	Surface Mount	32 Gbit	FLASH - NOR			133 MHz	4M x 8	FLASH	Non-Volatile	3 ms
Winbond Electronics W25Q32FVSFJQ	105 °C	-40 °C	2.7 V	3.6 V	16-SOIC	16-SOIC	QPI Quad I/O SPI	Surface Mount	32 Gbit	FLASH - NOR	3 ms	50 µs	104 MHz	4M x 8	FLASH	Non-Volatile			0.295 in	7.5 mm
Winbond Electronics W25Q32JVSTIQ TR	85 °C	-40 °C	2.7 V	3.6 V	8-SOIC	8-VSOP	SPI - Quad I/O	Surface Mount	32 Gbit	FLASH - NOR			133 MHz	4M x 8	FLASH	Non-Volatile	3 ms		0.209 "	5.3 mm
Winbond Electronics W25Q32BVTBJP TR	105 °C	-40 °C	2.7 V	3.6 V	24-TBGA	24-TFBGA (8x6)	SPI - Quad I/O	Surface Mount	32 Gbit	FLASH - NOR	3 ms	50 µs	104 MHz	4M x 8	FLASH	Non-Volatile
Winbond Electronics W25Q32FVTCJQ	105 °C	-40 °C	2.7 V	3.6 V	24-TBGA	24-TFBGA (8x6)	QPI Quad I/O SPI	Surface Mount	32 Gbit	FLASH - NOR	3 ms	50 µs	104 MHz	4M x 8	FLASH	Non-Volatile

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

W25Q32 Series

FLASH - NOR Memory IC 32Mbit SPI - Quad I/O, QPI 104 MHz 7 ns 8-WSON (8x6)

Documents

Technical documentation and resources

No documents available