IC FLASH 32MBIT SPI/QUAD 24TFBGA
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Voltage - Supply [Min] | Voltage - Supply [Max] | Package / Case | Supplier Device Package | Memory Interface | Mounting Type | Memory Size | Technology | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Clock Frequency | Memory Organization | Memory Format | Memory Type | Write Cycle Time - Word, Page | Access Time | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 105 °C | -40 °C | 2.7 V | 3.6 V | 24-TBGA | 24-TFBGA (8x6) | QPI Quad I/O SPI | Surface Mount | 32 Gbit | FLASH - NOR | 3 ms | 50 µs | 104 MHz | 4M x 8 | FLASH | Non-Volatile | ||||
Winbond Electronics | 85 °C | -40 °C | 2.7 V | 3.6 V | 16-SOIC | 16-SOIC | DTR QPI Quad I/O SPI | Surface Mount | 32 Gbit | FLASH - NOR | 133 MHz | 4M x 8 | FLASH | Non-Volatile | 3 ms | 6 ns | 0.295 in | 7.5 mm | ||
Winbond Electronics | 105 °C | -40 °C | 2.7 V | 3.6 V | 24-TBGA | 24-TFBGA (8x6) | QPI Quad I/O SPI | Surface Mount | 32 Gbit | FLASH - NOR | 3 ms | 50 µs | 104 MHz | 4M x 8 | FLASH | Non-Volatile | ||||
Winbond Electronics | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-WDFN Exposed Pad | 8-WSON (8x6) | QPI Quad I/O SPI | Surface Mount | 32 Gbit | FLASH - NOR | 3 ms | 50 µs | 104 MHz | 4M x 8 | FLASH | Non-Volatile | 7 ns | |||
Winbond Electronics | 85 °C | -40 °C | 2.7 V | 3.6 V | 24-TBGA | 24-TFBGA (8x6) | SPI - Quad I/O | Surface Mount | 32 Gbit | FLASH - NOR | 133 MHz | 4M x 8 | FLASH | Non-Volatile | 3 ms | |||||
Winbond Electronics | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-XDFN Exposed Pad | 8-XSON (4x4) | SPI - Quad I/O | Surface Mount | 32 Gbit | FLASH - NOR | 133 MHz | 4M x 8 | FLASH | Non-Volatile | 3 ms | |||||
Winbond Electronics | 105 °C | -40 °C | 2.7 V | 3.6 V | 16-SOIC | 16-SOIC | QPI Quad I/O SPI | Surface Mount | 32 Gbit | FLASH - NOR | 3 ms | 50 µs | 104 MHz | 4M x 8 | FLASH | Non-Volatile | 0.295 in | 7.5 mm | ||
Winbond Electronics | 85 °C | -40 °C | 2.7 V | 3.6 V | 8-SOIC | 8-VSOP | SPI - Quad I/O | Surface Mount | 32 Gbit | FLASH - NOR | 133 MHz | 4M x 8 | FLASH | Non-Volatile | 3 ms | 0.209 " | 5.3 mm | |||
Winbond Electronics | 105 °C | -40 °C | 2.7 V | 3.6 V | 24-TBGA | 24-TFBGA (8x6) | SPI - Quad I/O | Surface Mount | 32 Gbit | FLASH - NOR | 3 ms | 50 µs | 104 MHz | 4M x 8 | FLASH | Non-Volatile | ||||
Winbond Electronics | 105 °C | -40 °C | 2.7 V | 3.6 V | 24-TBGA | 24-TFBGA (8x6) | QPI Quad I/O SPI | Surface Mount | 32 Gbit | FLASH - NOR | 3 ms | 50 µs | 104 MHz | 4M x 8 | FLASH | Non-Volatile |