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SCT2080KEGC11 - Product dimension image

SCT2080KEGC11

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 40 A, 1.2 KV, 0.08 OHM, TO-247N

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SCT2080KEGC11 - Product dimension image

SCT2080KEGC11

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, SINGLE, N CHANNEL, 40 A, 1.2 KV, 0.08 OHM, TO-247N

Technical Specifications

Parameters and characteristics for this part

SpecificationSCT2080KEGC11
Drain to Source Voltage (Vdss)1200 V
Drive Voltage (Max Rds On, Min Rds On)18 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]106 nC
Input Capacitance (Ciss) (Max) @ Vds2080 pF
Mounting TypeThrough Hole
Operating Temperature175 °C
Package / CaseTO-247-3
Power Dissipation (Max)262 W
Rds On (Max) @ Id, Vgs117 mOhm
Supplier Device PackageTO-247N
Vgs (Max) [Max]22 V
Vgs (Max) [Min]-6 V
Vgs(th) (Max) @ Id4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 26.53
10$ 19.30
450$ 16.05
NewarkEach 1$ 27.37
5$ 23.67
10$ 19.96
25$ 19.33
50$ 19.33
100$ 19.32
250$ 19.32

Description

General part information

SCT2080KE Series

This is an SiC (Silicon Carbide) planar MOSFET. (SiC-SBD not co-packed) Features include high voltage resistance, low ON resistance, and fast switching speed.

Documents

Technical documentation and resources

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking - TO-247N SiC_Marking-e.pdf

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Taping Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

SCT2080KE Data Sheet

Data Sheet

ESD Data

Characteristics Data

Anti-Whisker formation

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Constitution Materials List

Environmental Data

About Flammability of Materials

Environmental Data

5kW High-Efficiency Fan-less Inverter

Schematic Design & Verification

Best practices for the connection of Driver Source/Emitter terminals in discrete devices

Schematic Design & Verification

How to Use PLECS Models

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Precautions during gate-source voltage measurement for SiC MOSFET

Schematic Design & Verification

SiC MOSFET Layout Design Considerations

Technical Article

Basics and Design Guidelines for Gate Drive Circuits

Schematic Design & Verification

What Is Thermal Design

Thermal Design

How to Create Symbols for PSpice Models

Models

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Gate-Source Voltage Surge Suppression Methods

Schematic Design & Verification

About Export Administration Regulations (EAR)

Export Information

Reliability Test Result

Manufacturing Data

Calculating Power Loss from Measured Waveforms

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Compliance of the ELV directive

Environmental Data

Package Dimensions

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Solving the challenges of driving SiC MOSFETs with new packaging developments

White Paper

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Snubber circuit design methods for SiC MOSFET

Schematic Design & Verification

Technical Data Sheet EN

Datasheet