81-01-14618-2000

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Parker Chomerics

RFI FINGERSTOCK BECU UNPLAT ADH

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Parker Chomerics

RFI FINGERSTOCK BECU UNPLAT ADH

Technical Specifications

Parameters and characteristics for this part

Part	Height [z]	Height [z]	Length [x]	Length [x]	Plating	Width [x]	Width	Material	Attachment Method	Type	Operating Temperature [Min]	Operating Temperature [Max]	Width	Width [x]	Length	Length
Parker Chomerics 81-01-14215-2000	0.13 in	3.3 mm	457 mm	17.992 in	Unplated	0.37 in	9.4 mm	Beryllium Copper	Non-Conductive Adhesive	Fingerstock	-40 °C	121 °C
Parker Chomerics 81-01-32AS1-2000	0.22 in	5.59 mm	457 mm	17.992 in	Unplated		15.24 mm	Beryllium Copper	Non-Conductive Adhesive	Fingerstock	-40 °C	121 °C	0.6 in
Parker Chomerics 81-01-14309-2000	0.22 in	5.59 mm			Unplated	0.561 in		Beryllium Copper	Non-Conductive Adhesive	Fingerstock	-40 °C	121 °C		14.24 mm	15.748 in	400 mm
Parker Chomerics 81-01-14618-2000	0.1 in	2.54 mm	406 mm	15.984 "	Unplated	0.3 "	7.62 mm	Beryllium Copper	Non-Conductive Adhesive	Fingerstock	-40 °C	121 °C

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