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06-3508-20 - Product Image

06-3508-20

Active
Aries Electronics

6P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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06-3508-20 - Product Image

06-3508-20

Active
Aries Electronics

6P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification06-3508-20
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid) [custom]2
Number of Positions or Pins (Grid) [custom]6
Number of Positions or Pins (Grid) [custom]3
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationWire Wrap
Termination Post Length [x]0.36 in
Termination Post Length [x]9.14 mm
Type0.3 "
Type7.62 mm
TypeDIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 138$ 2.72
LCSCPiece 1$ 7.40
204$ 2.95
493$ 2.86
1003$ 2.81

Description

General part information

06-3508 Series

6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources