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6P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Pitch - Post | Pitch - Post | Features | Termination Post Length [x] | Termination Post Length [x] | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Finish - Mating | Type | Type | Type | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Post | Termination | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Mounting Type | Contact Material - Post [custom] | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | Open Frame | 0.36 in | 9.14 mm | 3 A | 200 µin | 5.08 µm | Beryllium Copper | Gold | 0.3 " | 7.62 mm | DIP | 105 ░C | -55 °C | Tin | Wire Wrap | 0.1 in | 2.54 mm | 2 | 6 | 3 | Through Hole | Brass | UL94 V-0 | 30 Áin | 0.76 Ám | Glass Filled Nylon 4/6 Polyamide (PA46) |